IEC 60068-2-58:1999

Overview

IEC 60068-2-58:1999 is an international standard developed by the International Electrotechnical Commission (IEC) for environmental testing of electronic components, specifically surface mounting devices (SMD). Titled “Environmental testing - Part 2-58: Tests - Test Td - Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD),” this standard specifies procedures to determine the solderability, resistance to metallization dissolution, and soldering heat resistance of SMDs. The methods described include solder bath and reflow techniques, making the standard particularly important for manufacturers, testing laboratories, and quality assurance teams involved in electronics assembly and electronic component reliability testing.

Key Topics

• Solderability Testing: Evaluates the ability of SMD terminals to be wetted by solder, ensuring reliable electrical and mechanical connection.
• Resistance to Dissolution of Metallization: Assesses the durability of metallized surfaces under thermal and chemical stresses during soldering, minimizing the risk of degraded solder joints.
• Resistance to Soldering Heat: Examines the ability of SMDs to withstand the thermal stress encountered during the soldering process without damage or performance loss.
• Test Methods:
  • Solder Bath Method: Immersion of devices in molten solder at controlled temperatures and durations to simulate wave or dip soldering.
  • Reflow Method: Exposure of devices to reflow soldering conditions using solder paste and carefully controlled heat profiles, simulating surface mount reflow processes.
• Visual Examination Criteria: Defines acceptable limits for wetting and dewetting, ensuring high-quality solder coverage.
• Requirements for Test Conditions: Specifies essential parameters such as solder composition, flux type, temperature profiles, number of cycles, and inspection requirements.

Applications

• Surface Mount Technology (SMT) Manufacturing: Ensures that SMDs used in SMT assembly have adequate solderability and can endure soldering heat, reducing manufacturing defects.
• Quality Assurance in Electronics Production: Implementation of IEC 60068-2-58 testing helps maintain high reliability and consistency in electronic assemblies, minimizing field failures due to poor solder joints.
• Component Qualification and Supplier Audits: Electronics manufacturers use this standard to qualify new suppliers and incoming components, ensuring compliance with international reliability and quality requirements.
• Design Validation and Failure Analysis: When developing new SMDs or troubleshooting soldering issues in assemblies, the methods outlined provide a technical baseline for process improvements and root cause analysis.
• Regulatory and Certification Testing: Many global markets recognize IEC standards; adhering to IEC 60068-2-58 facilitates compliance with regulatory requirements and supports product certification processes.

Related Standards

• IEC 60068-2-20: Environmental testing - Soldering test methods for electrotechnical products.
• IEC 60068-2-54: Wetting balance method for solderability testing of electronic components.
• IEC 60068-2-69: Solderability testing of electronic components for surface mount technology by the wetting balance method.
• IEC 60749: Mechanical and climatic test methods for semiconductor devices.
• IEC 60068-1: General guidance for environmental testing.

By following IEC 60068-2-58, organizations can comprehensively evaluate the ability of surface mounting devices to withstand critical phases of the soldering process, supporting robust product design, manufacturing quality, and long-term reliability in electronic applications worldwide.