★Низкие цены. Оригиналы и переводы — экономьте время и бюджет.

Каталог Подписки О компании Поддержка и оплата Публичная оферта Контакты

Поиск

Корзинапуста

GLSTDStandards Store

Официальный магазин стандартов ГОСТ, ISO, ASTM. Электронная доставка, актуальные редакции, прозрачные цены.

Компания

О компании
Контакты
Поддержка и оплата

Помощь

Каталог
Корзина
Поиск

Правовая информация

Публичная оферта
Политика конфиденциальности
Условия использования

Способы оплаты:

IEC 60191-2X:1999 PDF — Mechanical standardization of semiconductor devices - Part 2: Dimensi… — GOST Standards

//IEC 60191-2X:1999

IEC 60191-2X:1999

Name: IEC 60191-2X:1999 — Mechanical standardization of semiconductor devices - Part 2: Dimensions
SKU: IEC 60191-2X:1999
Price: 50400 RUB
Availability: InStock

Mechanical standardization of semiconductor devices - Part 2: Dimensions

Название (английский):

IEC 60191-2X:1999

Mechanical standardization of semiconductor devices - Part 2: Dimensions

Статус документа:: Действующий
Формат:: Электронный (PDF)
Количество страниц:: 28
Дата публикации:: 30 сентября 1999 г.
Издание:: IEC IS 60191 edition 1 version 1
ICS:: 31.080.01

Тип поставки:

Full version50 400 ₽Read online 24h1 200 ₽Read online 72h1 800 ₽

Язык документа:

ruen

Срок поставки:5 раб. дн. (перевод)

Цена:50 400 ₽

Описание (английский):

The contents of the corrigendum of January 2000 have been included in this copy.

Abstract

Overview

IEC 60191-2X:1999 is an international standard published by the International Electrotechnical Commission (IEC) that focuses on the mechanical standardization of semiconductor devices, specifically their . This document is the twenty-second supplement to the original published in 1966, incorporating updates and corrigenda up to January 2000.

Key Topics

Mechanical Standardization Philosophy The standard outlines fundamental rules for mechanical standardization to ensure interchangeability, precise dimensioning, and global acceptance of semiconductor device outlines. It prioritizes international support for package types, continuous review of existing standards, and the removal of obsolete designs.
Device Outline Drawings The document provides comprehensive device outline drawings with exact dimensional specifications. These drawings serve as templates to manufacture packages to exact mechanical tolerances.
Package Types and Dimensions It covers a wide range of commonly mounted semiconductor device packages, specifying dimensions critical for compatibility and automated assembly.
Base, Case, and Gauge Drawings The standard includes detailed base drawings, case outlines, and gauge designs to complement the device outlines and ensure complete mechanical standardization across all semiconductor packages.
Obsolete and Updated Drawings IEC 60191-2X designates obsolete drawings separately, along with timelines for their removal, supporting efficient update and maintenance of current industry standards.
National Code Integration The standard integrates national codes representing different countries' support, enabling global consensus and traceability in semiconductor packaging.

Applications

Semiconductor Device Manufacturing Manufacturers utilize IEC 60191-2X for designing and producing semiconductor packages with standardized dimensions to ensure compatibility with automated assembly lines and testing equipment.
Automated Assembly & Handling Precise mechanical specifications facilitate robotic pick-and-place and automated handling systems, enhancing production efficiency and reducing errors.
Quality Assurance & Compliance Design and production teams rely on this standard to comply with international mechanical requirements, ensuring devices meet global market expectations.
Interoperability Across Markets By adhering to IEC 60191-2X, semiconductor devices achieve interoperability in devices, equipment, and systems worldwide, simplifying integration and reducing costs.
Standardized Documentation Engineers and technical writers reference this standard to create consistent technical documentation, datasheets, and design guides.

Related Standards

IEC 60191-2 (Original 1966 Publication) The foundation document describing mechanical standardization of semiconductor device dimensions.
IEC 60191-1 (Part 1: General Requirements) Covers general mechanical requirements and guidelines for semiconductor devices, complementing the dimensional focus of Part 2.
ISO/IEC Joint Standards for Electronics Packaging Collaborative standards complementing mechanical dimensions with additional electrical, thermal, and environmental specifications.
Industry-Specific Package Standards (JEDEC, EIA, etc.) Regional and industry bodies often align their mechanical semiconductor package standards with IEC 60191-2X for harmonization.

Keywords: IEC 60191-2X, semiconductor device dimensions, mechanical standardization, semiconductor packaging, device outline drawings, automated assembly, international semiconductor standards, IEC semiconductor standards, package mechanical specifications.

Технические детали

Технический комитет: SC 47D - Semiconductor devices packaging
SKU: IEC 60191-2X:1999

Главная

Каталог

IEC 60191-2W:1999

Действующий

Twenty-first supplement

Overview IEC 60191-2W:1999 represents the twenty-first supplement to the IEC 60191-2 (1966) standard focused on the mechanical standardization of semiconductor devices. Published by the International…

25 · PDF

45 000 ₽

BS IEC 60191-1:2007

Отменён

Mechanical standardization of semiconductor devices - General rules for the preparation of outline drawings o…

PDF

6 000 ₽

IEC 63522-45:2025

Действующий

Electrical relays - Tests and measurements - Part 45: Maximum frequency of operation

Overview IEC 63522-45:2025 is an International Standard developed by the International Electrotechnical Commission (IEC) specifically for electromechanical elementary relays. This includes electromec…

26 · PDF

46 800 ₽

IEC 60332-3-24:2018/ISH1:2019

Действующий

Interpretation sheet 1 - Tests on electric and optical fibre cables under fire conditions - Part 3-24: Test f…

1 · PDF

1 800 ₽

IEC 62040-2:2016/ISH1:2018

Действующий

Interpretation sheet 1 - Uninterruptible power systems (UPS) - Part 2: Electromagnetic compatibility (EMC) re…

3 · PDF

5 400 ₽

IEC/IEEE 61886-2:2025

Действующий

Subsea equipment - Part 2: Power transformers

Overview IEC/IEEE 61886-2:2025 - Subsea equipment, Part 2: Power transformers is a dual-logo IEC/IEEE standard that defines additional requirements for liquid‑immersed subsea power transformers (incl…

52 · PDF

93 600 ₽

IEC 60191-2Z:2000

Действующий

Twenty-fourth supplement - Mechanical standardization of semiconductor devices - Part 2: Dimensions

Overview IEC 60191-2Z:2000 is the twenty-fourth supplement to IEC 60191-2 (1966), focusing on the mechanical standardization of semiconductor devices, specifically addressing dimensions. Published by…

15 · PDF

27 000 ₽