IEC 60194-2:2017

Overview

IEC 60194-2:2017 is a key international standard developed by the International Electrotechnical Commission (IEC) that defines the vocabulary and terminology used in printed board and electronic assembly technologies, as well as related electronic technologies. This first edition, in conjunction with IEC 60194-1, replaces the previous IEC 60194:2015 and introduces several technical revisions to align with current industry practices and technological advancements. The standard is essential for ensuring consistent communication and understanding across global electronics design, manufacturing, and assembly sectors.

Key Topics

IEC 60194-2:2017 focuses on terminology relevant to:

• Printed circuit boards (PCBs): Including terms for design, fabrication, and assembly processes.
• Electronic components and assemblies: Such as definitions related to packaging (BGA, chip-on-board, etc.), materials, and mounting technologies.
• Device embedded substrate technology: Inclusion of new terms reflecting the latest advancements in embedded device integration.
• Manufacturing and inspection: Vocabulary for quality processes, acceptance criteria, and defect identification.
• Electrical characteristics: Terms describing key properties such as capacitance, conductance, dielectric strength, and electromagnetic compatibility.
• Revision management: Excludes obsolete or redundant terms to maintain industry relevance.

Significant updates in this edition include:

• Exclusion of general terms better covered by other technical committees.
• Removal of outdated industry terms.
• Addition of new terminology for cutting-edge technologies in device embedded substrates.
• Simplification by removing identification codes and annexes for easier reference.

Applications

The practical applications of IEC 60194-2:2017 are broad and impactful:

• Standardization: Enables consistent use of terms across technical documents, specifications, training materials, and product datasheets.
• Design & Engineering: Supports PCB designers, electrical engineers, and product developers with standardized vocabulary to avoid ambiguity during global collaboration.
• Manufacturing & Quality Control: Assists manufacturers and quality assurance teams in ensuring mutual understanding of quality requirements, testing procedures, and non-conformance terms.
• Training: Provides a foundation for technical education and certification of personnel in the electronics industry.
• Procurement & Supply Chain: Facilitates supplier-customer communication by providing a common language for technical requirements and specifications.

By adhering to IEC 60194-2, organizations benefit from fewer misunderstandings, streamlined documentation, and more efficient cross-border partnerships in the design and production of electronic assemblies.

Related Standards

For comprehensive coverage and consistency in electronics terminology and practices, the following related standards should be referenced alongside IEC 60194-2:2017:

• IEC 60194-1: Printed boards design, manufacture and assembly - Vocabulary - Part 1: Common usage in printed board and electronic assembly technologies.
• IEC 60050 Series: International Electrotechnical Vocabulary (IEV) - the authoritative source for electrotechnical terms.
• IEC 61188 series: Standards for printed circuit board design.
• IPC/JEDEC and ISO standards: For regional compliance and industry-specific adaptation.
• IEC Electropedia: An online dictionary resource for electrotechnical terminology.

By using IEC 60194-2:2017 as a reference, companies, engineers, and educators ensure clarity, efficiency, and accuracy in technical communication across every stage of electronic product lifecycle management. Compliance with this standard strengthens international cooperation and supports continuous innovation in the rapidly evolving electronics sector.