IEC 60749-16:2003
Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND)
Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND)
- Статус документа:
- Действующий
- Формат:
- Электронный (PDF)
- Количество страниц:
- 13
- Дата публикации:
- 17 января 2003 г.
- Издание:
- IEC IS 60749 edition 1 version 1
- ICS:
- 31.080.01
Defines a test aiming at detecting the presence of loose particles inside a cavity device such as, for example, chips of ceramic, pieces of bonding wire or solder balls (prills).
Abstract
Overview
IEC 60749-16:2003 is an international standard that specifies a non-destructive mechanical and climatic test method called Particle Impact Noise Detection (PIND). This test targets the detection of loose particles inside cavity semiconductor devices, which could adversely affect device reliability. Such particles include ceramic chips, bonding wire fragments, or solder balls (prills).
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