IEC 61967-2:2005
Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 2: Measurement of radiated emissions - TEM cell and wideband TEM cell method
Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 2: Measurement of radiated emissions - TEM cell and wideband TEM cell method
- Статус документа:
- Действующий
- Формат:
- Электронный (PDF)
- Количество страниц:
- 43
- Дата публикации:
- 29 сентября 2005 г.
- Издание:
- IEC IS 61967 edition 1 version 1
- ICS:
- 31.080.99
This test procedure defines a method for measuring the electromagnetic radiation from an integrated circuit (IC). The IC being evaluated is mounted on an IC test printed circuit board (PCB) that is clamped to a mating port (referred to as a wall port) cut in the top or bottom of a transverse electromagnetic (TEM) or wideband gigahertz TEM (GTEM) cell. The test board is not inside the cell, as in the conventional usage, but becomes a part of the cell wall. This method is applicable to any TEM or GTEM cell modified to incorporate the wall port; however, the measured radio frequency (RF) voltage will be affected by many factors. The primary factor affecting the measured RF voltage is the septum to IC test board (cell wall) spacing. This procedure was developed using a 1 GHz TEM cell with a septum to floor spacing of 45 mm and a GTEM cell with average septum to floor spacing of 45 mm over the port area. Other cells may not produce identical spectral output but may be used for comparative measurements, subject to their frequency and sensitivity limitations. A conversion factor may allow comparisons between data measured on TEM or GTEM cells with different septum to floor spacing. The IC test board controls the geometry and orientation of the operating IC relative to the cell and eliminates any connecting leads within the cell (these are on the backside of the board, which is outside the cell). For the TEM cell, one of the 50 ports is terminated with a 50 load. The other 50 port for a TEM cell, or the single 50 port for a GTEM cell, is connected to the input of a spectrum analyser or receiver that measures the RF emissions emanating from the integrated circuit and impressed onto the septum of the cell.
Abstract
Overview
IEC 61967-2:2005 is an international standard developed by the International Electrotechnical Commission (IEC) that specifies a test procedure for measuring electromagnetic emissions radiated by integrated circuits (ICs) within the frequency range of 150 kHz to 1 GHz. This standard focuses on radiated emission measurement methods using transverse electromagnetic (TEM) cells and wideband TEM (GTEM) cells. Its primary purpose is to provide a reliable and repeatable procedure to evaluate the electromagnetic interference (EMI) characteristics of ICs, an essential aspect of ensuring compliance with EMC (electromagnetic compatibility) requirements in electronic systems.
Key Topics
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Measurement Scope The standard defines methods for assessing radiated electromagnetic emissions from ICs by mounting the device-under-test (DUT) on a specialized printed circuit board (PCB) that interfaces with a TEM or wideband TEM cell via a wall port.
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TEM and GTEM Cell Methodology Unlike conventional use, the test PCB forms part of the wall of the TEM or GTEM cell, eliminating the need for internal lead connections and reducing measurement variability. The DUT’s emissions are coupled directly to the cell septum and measured through a 50 Ω terminated port connected to spectrum analyzers or receivers.
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Frequency Range The defined frequency span of 150 kHz to 1 GHz covers a broad range of emissions relevant for integrated circuit operation and regulatory compliance testing.
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Test Conditions and Set-up Details include specifications for shielding, RF measurement instruments, preamplifiers, and load terminations, ensuring repeatability and accuracy. The standard also discusses the critical influence of septum-to-test board spacing on measurement results.
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Calibration and Reporting IEC 61967-2 outlines procedures for calibration verification, operational checks, and structured reporting to maintain consistent test quality and facilitate data comparison across different test environments.
Applications
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Electromagnetic Compatibility (EMC) Testing Manufacturers of integrated circuits use this standard as part of their EMC evaluation protocols to ensure that their products meet regulatory emission limits and minimize interference risks in electronic environments.
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Product Development and Validation The standard’s precise measurement methodology aids R&D teams in identifying and mitigating electromagnetic emission issues during IC design phases.
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Comparative Emission Analysis By providing a uniform test framework, the standard allows product developers and certification bodies to perform comparative analyses of IC emission characteristics across different cell types and configurations.
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Qualification for Certification Compliance with IEC 61967-2-based testing supports fulfilling international EMC directives and helps in obtaining product certifications necessary for global market access.
Related Standards
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IEC 61967-1 – Measurement of conducted electromagnetic emissions from integrated circuits, complementing the radiated emission tests specified in Part 2.
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IEC 61000 Series – Covers a broader range of EMC standards, including immunity testing and environmental effects, which integrate with radiated emission measurements.
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CISPR 22 and CISPR 32 – International standards defining limits and measurement methods for electromagnetic emissions from information technology equipment, relevant for final product EMC compliance.
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ISO/IEC 17025 – Accreditation requirements for testing laboratories performing measurements in accordance with IEC 61967-2, ensuring competence and reliable results.
Key Benefits of IEC 61967-2
- Provides a standardized, repeatable method for radiated emission measurement of ICs.
- Enhances the accuracy of EMI characterization by eliminating internal lead coupling.
- Supports regulatory compliance and facilitates international product certification.
- Enables manufacturers to better understand and control electromagnetic emissions during IC design and production.
For entities involved in IC testing, design, or certification, IEC 61967-2:2005 offers essential guidance and methodological rigor for assessing radiated emissions within a critical frequency spectrum, ensuring products meet EMC requirements and contribute to the stability and reliability of electronic systems worldwide.
Технические детали
- Технический комитет
- SC 47A - Integrated circuits
- SKU
- IEC 61967-2:2005
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