IEC 62148-19:2019

Name: IEC 62148-19:2019 — Fibre optic active components and devices - Package and interface standards - Part 19: Photonic chip scale package
SKU: IEC 62148-19:2019
Price: 35 EUR
Availability: InStock

Fibre optic active components and devices - Package and interface standards - Part 19: Photonic chip scale package

Название (английский):

IEC 62148-19:2019

Fibre optic active components and devices - Package and interface standards - Part 19: Photonic chip scale package

Статус документа:: Действующий
Формат:: Электронный (PDF)
Количество страниц:: 78
Дата публикации:: 2 мая 2019 г.
Издание:: IEC IS 62148 edition 1 version 1
ICS:: 33.180.20

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Цена:35 €

Описание (английский):

IEC 62148-19: 2019 covers the photonic chip scale package. The purpose of this document is to specify adequately the physical requirements of optical transmitters and receivers that will enable mechanical interchangeability of transmitters and receivers. Keywords: physical interface for photonic chip scale packages

Abstract

Overview

Key Topics

Scope and Purpose: Standardizes the physical interface of photonic chip scale packages to allow mechanical interchangeability of transmitters and receivers.
Classification: Defines types of devices covered under the photonic CSP category.
General Block Diagram: Illustrates silicon photonics-based chip scale package structure.
Electrical Interface:
- Terminal numbering and function definitions.
- High-speed electrical interface considerations.
Optical Interface:
- Specifications for free space optical beam conditions.
- Optical terminal assignments with detailed pitch layout.
Outline and Footprint:
- Package outline dimensions for multiple channel configurations.
- Recommended PCB pattern layouts for integration.
Specific Configurations:
- Defined standards for 4-channel, 8-channel, and 12-channel transceivers, transmitters, and receivers.
- Includes detailed electrical and optical terminal assignments and block diagrams.
- Mechanical drawings with dimensions for mounting and integration.

Applications

IEC 62148-19:2019 is highly relevant for industries and professionals involved in the design, manufacture, and deployment of fibre optic components and systems, including:

Telecommunications: Enabling compact, high-performance optical transceivers in fibre optic networks.
Data Centers: Facilitating dense integration of photonic devices for high-speed, energy-efficient data transmission.
Silicon Photonics Development: Supporting the standardization of packaging used in advanced silicon photonics chips.
Optical Module Manufacturers: Providing a reference for mechanical and electrical interfaces, ensuring compatibility and interchangeability.
System Integrators: Assisting in selecting standardized photonic chip components that fit established footprints and interfaces.
Test and Measurement Equipment: Ensuring consistent component specifications for accurate optical performance testing.

By following IEC 62148-19, organizations can reduce development time, ensure interoperability across suppliers, and support scalability to higher channel counts and complex photonic systems.

Related Standards

IEC 62148-19:2019 is part of a broader series dedicated to fibre optic active components and device packaging, including:

IEC 62148 Series: Covers general packaging and interface standards for fibre optic components.
Other parts in the IEC 62148 series that address different package types, mechanical standards, and electrical interfaces for various optical device configurations.
Coupled with standards from other organizations such as IEEE and ITU-T focusing on optical interfaces and communication protocols.

For additional terminology and electrotechnical vocabulary related to fibre optics, professionals can consult IEC’s Electropedia, the international online dictionary. The IEC webstore also provides access to the latest updates, corrigenda, and amendments to the IEC 62148 series.

Keywords: photonic chip scale package, IEC 62148-19, fibre optic active components, optical transmitters, optical receivers, mechanical interchangeability, silicon photonics packaging, optical module footprint, electrical interface, optical interface, fibre optic transceivers.

Технические детали

Технический комитет: SC 86C - Fibre optic systems, sensing and active devices
SKU: IEC 62148-19:2019

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IEC 62148-19:2019

Abstract

Overview

Похожие стандарты

Key Topics

Applications

Related Standards

Технические детали

IEC 62148-17:2023

Fibre optic active components and devices - Package and interface standards - Part 17: Transmitter and receiv…

IEC 62590-2-2:2026

Railway applications - Electronic power converters for fixed installations - Part 2-2: DC Traction applicatio…

IEC 61753-042-02:2026

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IEC 61837-2:2018

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IEC 61851-23-1:2026

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IEC 63506:2026

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IEC 63589-1:2026

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IEC 61837-2:2018/AMD2:2026

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