Overview
IEC 62148-21:2019 is an international standard published by the International Electrotechnical Commission (IEC) that focuses on fibre optic active components and devices. Specifically, it provides a design guide for the electrical interface of photonic integrated circuit (PIC) packages utilizing two advanced packaging technologies: silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA).
The document aims to deliver clear specifications to enable mechanical and electrical interchangeability of PIC packages composed of optical transmitters and receivers. While the guide mostly concentrates on S-FLGA packages, the S-FBGA interface is presented as informative, which helps design engineers in the fibre optic and photonics industry standardize their components.
Keywords: electrical interface of photonic integrated circuit (PIC) packages, S-FBGA, S-FLGA, PIC package design, fibre optic active components.
Key Topics
- Scope and Purpose: Covers the electrical interface design guide for PIC packages using S-FBGA and S-FLGA, focusing on ensuring interchangeability and compatibility.
- Package Dimension Codes: Defines nominal coding based on package width (D) and length (E), specified to the second decimal place in millimeters to allow precise manufacturing and design.
- Terminal Numbering and Positioning: Presents a standardized alphanumeric system for terminal row/column labeling to avoid confusion, excluding potentially confusing letters.
- Mechanical and Electrical Interface Drawings: Includes detailed figures illustrating package outlines, mechanical gauges, and terminal existence arrays. Defines key reference planes and dimensional symbols crucial for accurate interface definition.
- Dimension Tolerances: Specifies tight tolerances on package dimensions, terminal pitch, diameter, coplanarity, parallelism, and positional tolerances to guarantee package integrity and functional electrical contact.
- S-FBGA and S-FLGA Characteristics:
- S-FBGA includes silicon die with dielectric layers, rerouting wires to outer balls with heights more than 0.1 mm.
- S-FLGA includes similar structures but uses outer lands with heights 0.1 mm or less.
This standard integrates relevant terminology from IEC 60050-731 and IEC TR 61931, ensuring clarity and alignment with global electrotechnical vocabulary.
Applications
- Photonic Integrated Circuit Packaging: IEC 62148-21 guides the design of PIC packages that integrate optical transmitters and receivers with fine-pitch electrical interfaces, improving modularity and interchangeability in fibre optic systems.
- Telecommunications and Data Communications: Supports development of compact, reliable PIC modules used in high-speed data transmission over fibre optic networks.
- Microelectronics Manufacturing: Provides manufacturing standards critical for producing PIC packages with silicon-based fine-pitch arrays, optimizing signal integrity and reducing device footprint.
- Fibre Optic Component Interoperability: Enables standardization across different manufacturers and system vendors, facilitating seamless integration of photonic components in larger optical systems.
- Research and Development: Assists engineers and designers in developing next-generation photonics packaging solutions that require precise mechanical and electrical specifications.
Related Standards
- IEC 62148 Series: Covers broader package and interface standards related to fibre optic active components, offering complementary guidelines.
- IEC 60050-731: International Electrotechnical Vocabulary for optical fibre communications, providing terminological consistency.
- IEC TR 61931: Fibre optic terminology, supporting standardized language for fibre optic devices and components.
- ISO/IEC Directives: Governs structure and development rules for international standards ensuring coherence in document drafting.
By adhering to IEC 62148-21:2019, manufacturers and designers in the photonics and fibre optics sectors can ensure their PIC packages meet industry-wide electrical and mechanical interface expectations, streamlining deployment and enhancing compatibility across global markets.