IEC 62739-2:2016

Overview

IEC 62739-2:2016 is an international standard developed by the International Electrotechnical Commission (IEC) that specifies test methods for evaluating erosion in metallic materials with surface processing, which are used in lead-free wave soldering equipment. The main aim of this standard is to provide reliable and repeatable methods to assess how surface-processed metal components-such as solder baths and other parts in direct contact with molten lead-free solder alloys-perform over time. This helps manufacturers predict maintenance intervals and minimize the risks of accidents, equipment failure, or fire due to excessive material erosion.

Key Topics

• Test Methods for Erosion: IEC 62739-2:2016 details two primary methods:
  • Method A – Without Bending: Assesses erosion under standard operational conditions.
  • Method B – With Bending: An accelerated test to evaluate erosion under more severe conditions.
• Test Equipment Requirements: The standard outlines requirements for pots, rotation devices, and temperature controls, ensuring equipment can replicate the conditions within actual wave soldering systems.
• Specimen Preparation: Guidelines for selecting and preparing test specimens with surface processing that matches the actual application.
• Measurement Procedures: Specifies the use of optical microscopes and digital indicators to measure erosion depths precisely, with necessary accuracy standards.
• Dross Handling and Cleaning: Describes procedures for maintaining the quality of molten solder by regular removal of dross (oxidized waste material).
• Reporting Requirements: Standardizes the required documentation, such as date, materials, conditions, equipment numbers, erosion presence, and measured erosion depth.

Applications

IEC 62739-2:2016 is essential for manufacturers and users of electronic assembly equipment, particularly where molten lead-free solders are used. Key applications include:

• Selection of Erosion-Resistant Materials: Testing and qualifying surface-processed metal materials for use in solder baths and components exposed to molten solder, ensuring extended equipment lifespan and safer operation.
• Predictive Maintenance Scheduling: By understanding how various materials erode under specific processing conditions, manufacturers can plan optimal maintenance cycles, reducing downtime and costs.
• Quality Assurance: Standardized testing procedures improve consistency and reliability of test results, supporting quality assurance processes during product design, development, and ongoing production.
• Risk Mitigation: Reliable erosion data allows for better risk assessment, minimizing the potential for hazardous failures due to weakened solder bath components.

Related Standards

For comprehensive evaluation and adherence to best practices in electronics assembly, reference to the following related standards is beneficial:

• IEC 62739-1:2013: Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1 addresses metal materials without surface processing.
• IEC 61190-1-3: Specifies requirements for electronic grade solder alloys and solid solders used in soldering.
• IEC 60194:2015: Provides essential terminology for printed board design and manufacturing.
• ISO 16143 Series: Details standards for stainless steels for general purposes, including corrosion-resistant products relevant for solder bath construction.

Practical Value

Implementing IEC 62739-2:2016 in your production environment enables:

• Increased Equipment Reliability: By regularly testing and qualifying materials, you extend the service life of soldering equipment and reduce the likelihood of unplanned failures.
• Enhanced Safety: Early detection of erosion helps prevent potential accidents or fire hazards in electronics assembly facilities.
• Optimized Operational Efficiency: Standardized maintenance cycles informed by accurate erosion data lead to less downtime and more predictable operations.
• Regulatory Compliance: Using internationally recognized standards ensures global market access and conformance to industry requirements.

By adhering to IEC 62739-2:2016, organizations can achieve more efficient, safer, and cost-effective manufacturing processes in the electronics assembly industry, particularly those involving lead-free wave soldering operations.