IEC 62769-4:2023

Overview - IEC 62769-4:2023 (Field Device Integration - Part 4: FDI Packages)

IEC 62769-4:2023 (Edition 3.0, April 2023) defines the structure, contents and lifecycle rules for FDI Packages used in Field Device Integration (FDI®) solutions. The standard is part of the FDI architecture and specifies how device metadata, Electronic Device Descriptions (EDD), User Interface Plug-ins (UIP), attachments and catalogs are packaged, versioned, signed and deployed. It also prescribes the use of packaging technologies such as the Open Packaging Conventions (OPC) and defines digital signature / registration certificate handling for trusted distribution.

Note: FDI® is a registered trademark of the Fieldbus Foundation; the standard documents this for user awareness.

Key technical topics and requirements

• FDI Package Model and Elements: Defines the package catalog, package feature table, EDD, UIP, attachments and feature unit conversion elements required for a complete package.
• FDI Package Types: Specifies different package categories - e.g., Device Package, Communication Package, UIP Package, and Profile Package - and their intended roles.
• Packaging technology: Mandates use of standard packaging conventions (OPC) and addresses handling of unknown/invalid parts, relationships, thumbnails and core properties.
• Package parts and schemas: Describes required parts (catalog XML schema, protocol support files, localized strings, images) and includes an XML schema annex for the package catalog.
• Versioning and compatibility: Establishes a version scheme, version hierarchy and rules for UIP compatibility and element-level versioning.
• Security and provenance: Specifies digital signatures, FDI Registration Certificates, signing mechanisms and responsibilities of package originators and registration authorities.
• Deployment and lifecycle: Provides guidance for package creation, conformance testing, deployment scenarios (PC client/server and standalone systems), and lifecycle use cases such as updates, upgrades and replacement.
• Informative and normative annexes: Includes examples, OPC mapping, file naming conventions, conformance tools, life-cycle use cases, and device health and modular device considerations.

Practical applications and who uses it

• Device manufacturers packaging device metadata, EDDs and vendor UIs for distribution.
• Control system and DCS/SCADA vendors integrating device support into FDI Host applications.
• System integrators and automation engineers deploying device packages in plant environments.
• Software developers building UIPs, package creation tools, conformance test tools and package registries.
• Asset managers and operations teams ensuring secure, versioned device deployments and lifecycle updates.

Related standards (if applicable)

• Other parts of the IEC 62769 (FDI) series (for architecture, protocols and implementation guidance).
• Open Packaging Conventions (OPC) standards referenced for package structure.

Keywords: IEC 62769-4:2023, FDI Packages, Field Device Integration, Electronic Device Description, User Interface Plug-in, Open Packaging Conventions, digital signatures, package versioning, FDI Registration Certificate.