Overview
IEC 62878-2-5:2019 - Device embedding assembly technology - Part 2-5 provides guidelines for implementing a 3D data format for device embedded substrate designs. The standard defines an XML schema-based design data format to describe boards that contain embedded active and passive devices whose electrical connections use vias, electroplating, conductive paste, or printed conductive materials. The data format supports simulation, tooling, manufacturing, assembly and inspection, and enables information exchange between printed board designers, simulation engineers, manufacturers and assemblers.
Scope highlights
- Applies to substrates using organic material.
- Intended for 3D representation of embedded-device substrates (including SiP interposers).
- Excludes redistribution layers (RDL) and M-type electronic modules defined in IEC 62421.
Key Topics and Technical Requirements
- XML schema data model: A structured XML-based representation for complete 3D design data and metadata.
- 3D expression and coordinates: Definitions for coordinate origins, position description and board-relative placement to enable accurate 3D modelling.
- Layer concept and stack-up: Formal description of layer maps, stack-up information and virtual layers for multi-layer embedded substrates.
- Device and package description: Structured data for embedded devices, SiP elements, lands, vias and terminal definitions.
- Net, artwork and port information: Net connectivity, artwork details, external/internal ports, and package-to-board relationships.
- Primitive geometry and shapes: Points, areas, lines, letter shapes, truncated pyramids and other geometric primitives for accurate physical modelling.
- File organization: Recommended one-file or two-file structures for packaging design data and layering.
- User expansion fields: Extension points for vendor-specific or project-specific metadata.
- Use cases supported: Stress, thermal and EMC simulation; tooling and manufacturing planning; assembly and inspection workflows.
Applications
- Exchanging design-to-manufacturing data for embedded-component PCBs and system-in-package (SiP) substrates.
- Feeding 3D simulation tools for mechanical stress, thermal and EMC analysis.
- Generating tooling files and assembly instructions for manufacturers and assemblers.
- Supporting inspection and quality workflows through precise 3D model and port/land definitions.
Who should use this standard
- PCB and substrate designers working with embedded active/passive devices
- EDA/CAD tool vendors implementing data exchange formats
- Simulation engineers (thermal, stress, EMC)
- Board manufacturers, assemblers and inspection teams
- Supply chain partners requiring standardized 3D design data exchange
Related Standards
- IEC 62421 - referenced in scope for M-type module definitions
- Other parts of the IEC 62878 series on device embedding assembly technology (see IEC for complete series)
Using IEC 62878-2-5:2019 helps organizations standardize 3D device-embedded substrate data, reduce ambiguity in design-to-manufacture handoffs, and improve interoperability across CAD/EDA, simulation and production toolchains.