IEC 62951-8:2023

Overview

IEC 62951-8:2023 - "Semiconductor devices ­– Flexible and stretchable semiconductor devices – Part 8" - defines terms and specifies standardized test methods for stretchability, flexibility, and stability of flexible resistive memory. The standard describes experimental procedures, required test equipment and jigs, and general test-environment requirements (temperature and relative humidity). IEC 62951-8 focuses on stability evaluation under mechanical deformation (stretching and bending) rather than long-term reliability.

Key topics and technical requirements

• Scope and terminology
  • Definitions specific to flexible resistive memory (LRS/HRS, set/reset voltages, bending radius).
• Test methods
  • Stretchability test: tensile stress testing using strain as the primary metric (strain ε = (L1 − L0) / L0 × 100%). Grips should extend beyond the substrate; strain is geometry-dependent and preferred over force or stress.
  • Flexibility (bending) test: evaluates tensile and compressive strain from bending. Strain is derived from substrate thickness and bending radius (formulae provided; see Annex A for derivation and simulation).
  • Stability testing: performance checks performed in an environmental chamber to control temperature and relative humidity (test conditions and examples provided).
• Test equipment and setup
  • Probes for electrical characterization, specimen and substrate handling, dedicated jigs for stretch and bend modes, and environmental chambers for stability evaluations.
• Performance parameters to measure
  • I–V characteristics (switching behaviour), set/reset voltages, switching endurance (resistance change vs cycles), and retention (current vs time).
• Reporting
  • Key parameters before/during/after tests, environmental conditions, mechanical metrics (strain, bending radius), and equipment descriptions.

Applications and practical value

• Ensures consistent, comparable evaluation of flexible resistive memory used in:
  • Wearable electronics and smart textiles
  • Flexible sensors and IoT edge devices
  • Stretchable memory modules integrated into soft robotics or medical devices
• Useful for product verification, material selection, failure-mode analysis, and R&D when developing flexible memory elements or encapsulation schemes.

Who should use this standard

• Semiconductor manufacturers and device designers working on flexible resistive memory
• Test labs and quality assurance teams performing mechanical/electrical characterization
• Research groups and materials scientists studying stretchable electronics
• Product integrators in wearable and flexible electronics ecosystems

Related standards

• IEC 62951 series (see IEC 62951-1 for detailed performance parameters and characterization of flexible and stretchable semiconductor devices)

Keywords: IEC 62951-8, flexible resistive memory, stretchability test, flexibility test, stability testing, bending radius, strain, environmental chamber.