IEC 63215-2:2023

Overview

IEC 63215-2:2023 is an international standard published by the International Electrotechnical Commission (IEC) that specifies a temperature cycling test method for evaluating the endurance and reliability of die attach materials used in discrete type power electronic devices. The standard focuses on assessing the performance of die attach joints and joining systems under thermal stress that simulates actual operating conditions. This document forms Part 2 of the IEC 63215 series which addresses endurance test methods for die attach materials.

IEC 63215-2:2023 establishes a systematic procedure to test temperature cycling durability and introduces a reliability performance index to classify the joining reliability of die attach materials. It is important to note that this test method assesses the die attach materials themselves and the joining process, rather than the power semiconductor devices or their packages directly.

Key Topics

• Scope and Purpose The standard applies specifically to die attach materials and joining systems used for discrete power electronic devices. It is designed to evaluate the reliability of the die attach joint under cyclic thermal stress, ensuring that materials can withstand real-world temperature fluctuations.

• Temperature Cycling Test Conditions The document specifies test temperature ranges, dwell times, and cycling procedures that replicate typical thermal stresses experienced during the operation of power electronic devices. These conditions are established to provide meaningful endurance data on die attach materials.

• Test Apparatus and Setup Includes detailed requirements for required equipment such as die bonding tools, temperature cycling chambers, thermal resistance measuring equipment, and ultrasonic flaw inspection devices to monitor die attach joint integrity during and after testing.

• Specimen Preparation and Handling Guidelines for preparing test specimens, including the use of representative chips such as Thermoelectric Generator (TEG) chips, substrate preparation, and packaging treatments in line with reproducible, standardized test conditions.

• Evaluation and Inspection Methods Procedures for thermal resistance measurement and ultrasonic flaw detection are prescribed to assess mechanical and thermal degradation of the die attach joint throughout the test process.

• Reliability Performance Index A classification metric is introduced to rank joining reliability based on test results, enabling comparison between die attach materials and joining processes.

• Limitations The test method is not intended for device qualification or absolute quantification of reliability but serves for comparative evaluation of die attach materials.

Applications

IEC 63215-2:2023 is critical for organizations involved in the design, manufacture, and testing of discrete type power electronic devices, including:

• Semiconductor manufacturers developing new die attach materials and joining techniques aiming to enhance device longevity under thermal cycling conditions.

• Power electronics designers to select appropriate die attach materials that sustain reliable performance under thermal stress.

• Quality assurance and testing labs to implement standardized test protocols for endurance assessment of die attach joints.

• Research and development units focusing on improving thermal management and structural integrity of power semiconductor packages.

By adopting this standard, stakeholders can ensure more reliable power electronics devices, reducing failures caused by thermal fatigue in die attach regions and improving overall device robustness.

Related Standards

• IEC 63215-1: Endurance test methods for die attach materials - Part 1: [Basic test methods for die attach materials]
• IEC 60747 series: Semiconductor device standards covering testing and reliability aspects.
• JEDEC Standards: Various test methods for semiconductor material and assembly reliability applicable alongside IEC methods.
• ISO/IEC Directives: Guidelines for standard development followed by IEC to maintain international consistency.

Keywords

• Die attach materials
• Power electronic devices
• Temperature cycling test
• Thermal cycling endurance
• Reliability performance index
• Discrete semiconductor devices
• Thermal resistance measurement
• Ultrasonic flaw inspection
• Electronic assembly technology
• IEC standards for electronics testing

Adhering to IEC 63215-2:2023 helps ensure that die attach materials used in discrete power electronics are rigorously tested for thermal cycling endurance, enabling manufacturers to deliver products with high reliability and long-lasting performance under challenging operating environments.