IEC 63287-2:2023
Semiconductor devices - Guidelines for reliability qualification plans - Part 2: Concept of mission profile
Semiconductor devices - Guidelines for reliability qualification plans - Part 2: Concept of mission profile
- Статус документа:
- Действующий
- Формат:
- Электронный (PDF)
- Количество страниц:
- 30
- Дата публикации:
- 29 марта 2023 г.
- Издание:
- IEC IS 63287 edition 1 version 1
- ICS:
- 31.080.01
IEC 63287-2:2023 gives guidelines for the development of reliability qualification plans using the concept of mission profile, based on the environmental conditioning and proposed usage of the product. This document is not intended for military- and space-related applications.
Abstract
Overview
IEC 63287-2:2023, titled is an international standard published by the International Electrotechnical Commission (IEC). This document provides essential guidelines for developing reliability qualification plans for semiconductor devices by utilizing the concept of mission profiles. The guidelines focus on environmental conditioning and the proposed usage scenarios of the semiconductor product, enabling manufacturers and users to tailor reliability testing to real-world operational conditions. Notably, this standard excludes military and space-related applications.
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