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Infotainment services for public vehicles (PVIS) - Part 2: Requirements
Fixed capacitors for use in electronic equipment - Part 21: Sectional specification - Fixed surface mount multilayer capacitors of ceramic dielectric, Class 1
Wearable electronic devices and technologies - Part 801-1: Smart body area network (SmartBAN) - Enhanced ultra-low power physical layer
Process management for avionics - Counterfeit prevention - Part 1: Avoiding the use of counterfeit, fraudulent and recycled electronic components
Safety of power converters for use in photovoltaic power systems - Part 2: Particular requirements for inverters
Radio frequency and coaxial cable assemblies - Part 2-1: Sectional specification for flexible coaxial cable assemblies
Standard data element types with associated classification scheme for electric components - Part 6: IEC Common Data Dictionary (IEC CDD) quality guidelines
Electrical relays - Tests and measurements - Part 56: Ball Pressure test
Live working - Insulating aerial devices for mounting on a chassis
Industrial communication networks - Fieldbus specifications - Part 6-18: Application layer protocol specification - Type 18 elements
Power systems management and associated information exchange - Data and communications security - Part 8: Role-based access control
Binary power generation systems with capacity less than 100 kW - Performance test methods
Field device tool (FDT) interface specification - Part 2: Concepts and detailed description
Railway applications - Fixed installations - Protection principles for AC and DC electric traction power supply systems
Railway applications - Rolling stock - Part 1: Combined testing of inverter-fed alternating current motors and their control system
Conductive charging of electric vehicles - DC vehicle coupler configuration GG
Assessment of contact current related to human exposure to electric, magnetic and electromagnetic fields
Materials for printed boards and other interconnecting structures - Part 4-16: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional non-halogenated epoxi…
Electrical relays - Tests and measurements - Part 30: Contact sticking (delayed release)
Semiconductor devices - Part 18-2: Semiconductor bio sensors - Evaluation process of lens-free CMOS photonic array sensor package modules