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Страна: 🇧🇾 Стандарты Беларуси
Communication networks and systems for power utility automation - Part 90-21: Travelling Wave Fault Location
Specification for insulating materials based on mica - Part 1: Definitions and general requirements
Low-voltage surge protective devices - Part 31: Requirements and test methods for SPDs for photovoltaic installations
Power consumption of information technology equipment - Measurement methods
Capacitors for high‑voltage alternating current circuit‑breakers - Part 2: TRV capacitors
Medical electrical equipment - Part 4-5: Guidance and interpretation - Safety-related technical security specifications
Industrial communication networks - Fieldbus specifications - Part 1: Overview and guidance for the IEC 61158 and IEC 61784 series
Household and similar electrical appliances - Safety - Part 2-49: Particular requirements for commercial electric appliances for keeping food and crockery warm
Household and similar electrical appliances - Safety - Part 2-62: Particular requirements for commercial electric rinsing sinks
Functional performance criteria for AAL robots used in connected home environment
Piezoelectric and dielectric devices for frequency control and selection - Glossary - Part 1: Piezoelectric and dielectric resonators
Semiconductor devices - Measurement and evaluation methods of kinetic energy harvesting devices under practical vibration environment - Part 3: Human foot impact motion
Photovoltaic devices - Part 1-1: Measurement of current-voltage characteristics of multi-junction photovoltaic (PV) devices
Specifications for particular types of winding wires - Part 45: Polyester enamelled round copper wire, class 130
Determination of RF field strength, power density and SAR in the vicinity of base stations for the purpose of evaluating human exposure
Radio-frequency connectors. Part 19: R.F. coaxial connectors with inner diameter of outer conductor of 2.08 mm (0.082 in) with snap coupling. Characteristic impedance 50 ohms (Type SSMB)
Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpac…
Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 6: Test and evaluation methods for vertical contact mode triboelectric energy harvesting devices
Guidance for the interpretation of OTDR backscattering traces for single-mode fibres
Multicore and symmetrical pair/quad cables for broadband digital communications (high bit rate digital access telecommunication networks) - Outside plant cables - Part 4: Aerial drop cables - Sectional specification