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Securities and related financial instruments. Financial Instrument Short Name (FISN)
Press tools - Wear plates for press dies. Type A
Transportable gas cylinders. Cylinder bundles. Periodic inspection and testing
Road Vehicles. Glow-plugs with conical seating and their cylinder head housing - Basic characteristics and dimensions for metal-sheath-type glow-plugs
Hardmetals. Metallographic determination of microstructure - Measurement of WC grain size
Information technology. International standardized profiles. Common upper layer requirements - Basic connection oriented requirements for ROSE-based profiles
Harmonized system of quality assessment for electronic components. Blank detail specification. Fixed aluminium electrolytic a.c. capacitors with non-solid electrolyte for motor starter applications (Qualification approv…
Rubber hoses and hose assemblies for underground mining. Wire-reinforced hydraulic types for coal mining. Specification
Soil quality. Field soil description
Industrial communication networks. Installation of communication networks in industrial premises
Building construction. Determination of the staining of porous substrates by sealants used in joints - Test with compression
Hearing protectors. Testing - Acoustic test methods
Structural adhesives. Determination of the pot life (working life) of multi-component adhesives
Specification for slip (or block) gauges and their accessories
Overhead electrical lines exceeding AC 1 kV - National Normative Aspects (NNA) for Sweden (based on EN 50341-1:2012)
Specification for building limes
Aerospace series. Cables, electrical, for general purpose, single and multicore assembly. XLETFE Family. Jacketed or screened and jacketed - Silver plated copper. Operating temperatures, between -65 °C and 150 °C. Singl…
Emergency lighting - Code of practice for design, installation, maintenance and use of optical fibre systems
Cryogenic vessels. Pumps for cryogenic service
Harmonized system of quality assessment for electronic components. Sectional specification. Flex-rigid multilayer printed boards with through connections