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Electronic railway equipment - Train communication network (TCN) - Part 3-4: Ethernet Consist Network (ECN)
Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes
Fibre optic connector interfaces - Part 2: Type BFOC/2,5 connector family
Industrial communication networks - Fieldbus specifications - Part 6-13: Application layer protocol specification - Type 13 elements
Arc welding equipment - Part 11: Electrode holders
Winding wires - Test methods - Part 6: Thermal properties
Digital addressable lighting interface - Part 102: General requirements - Control gear
Lamp controlgear - Part 1: General and safety requirements
Field device tool (FDT) interface specification - Part 2: Concepts and detailed description
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300
Professional video storage products - Tape-less camera recorder using MXF file format - Encoding guidelines - Part 2: Mapping MPEG-2 and AVC Streams into MXF
Radio data system (RDS) - VHF/FM sound broadcasting in the frequency range from 64,0 MHz to 108,0 MHz - Part 1: Modulation characteristics and baseband coding
Combined flexible materials for electrical insulation - Part 1: Definitions and general requirements
Wearable electronic devices and technologies - Part 201-1: Electronic textile - Measurement methods for basic properties of conductive yarns
Medical electrical equipment - Part 2-64: Particular requirements for the basic safety and essential performance of light ion beam medical electrical equipment
Basic and safety principles for man-machine interface, marking and identification - Coding principles for indicators and actuators
Insulation coordination for equipment within low-voltage systems - Part 3: Use of coating, potting or moulding for protection against pollution
Optical fibre cables - Part 1-216: Generic specification - Basic optical cable test procedures - Environmental test methods - Compound flow (drip), Method F16
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
Safety of transformers, reactors, power supply units and combinations thereof - Part 2-9: Particular requirements and tests for transformers and power supply units for class III handlamps