DD IEC/PAS 61249-3-1:2007 PDF
Materials for printed boards and other interconnecting structures - Copper-clad laminates for flexible boards (adhesive and non-adhesive types)
Materials for printed boards and other interconnecting structures - Copper-clad laminates for flexible boards (adhesive and non-adhesive types)
- Статус документа:
- Действующий
- Формат:
- Электронный (PDF)
- Дата публикации:
- 31 октября 2007 г.
- ICS:
- 31.180
- SKU:
- DD IEC/PAS 61249-3-1:2007
Abstract
What is DD IEC/PAS 61249-3-1 ‒ Copper-clad laminates for flexible boards about?
DD IEC/PAS 61249-3-1 is an international standard that focuses on the copper-clad laminates and interconnecting structure of the printed board. DD IEC/PAS 61249-3-1 specifies the properties of copper-clad laminates used for flexible boards for both adhesive and non-adhesive types. DD IEC/PAS 61249-3-1 stipulates the technicalities such as related terms and definitions, designation of copper-clad laminate, observation, size of the base film and copper foil, adhesives, properties, package, labelling, as well as roughness test, and dimensional tests are given for copper-clad laminates for flexible boards.
Who is DD IEC/PAS 61249-3-1 ‒ Copper-clad laminates for flexible boards for ?
DD IEC/PAS 61249-3-1 on the copper-clad laminates for flexible boards is useful for:
Manufacturers of printed circuit boards (PCBs) Manufacturers of electronic components and interconnecting structures Manufacturers and suppliers of laminate sheets Quality control and testing personnel Regulatory authorities
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