Overview - EN 60747-15:2012 (Isolated power semiconductor devices)
EN 60747-15:2012 (adopting IEC 60747-15:2010) defines additional requirements for isolated power semiconductor devices - discrete power devices that provide electrical isolation between terminals and a base or case. It supplements the general semiconductor device rules in IEC 60747-1:2006 and the corresponding non‑isolated device parts of IEC 60747. The 2012 edition updates clause structure, measuring methods and test content compared with the 2004 version.
Key topics and technical requirements
- Scope and definitions - terminology and letter symbols specific to isolated devices (e.g., Visol).
- Essential ratings and characteristics - required ratings such as isolation voltage (Visol), terminal currents, total power dissipation, temperature limits, mechanical and climatic ratings.
- Electrical characteristics - parasitic behaviours including parasitic inductance (Lp) and parasitic capacitance (Cp), and partial discharge characteristics (inception/extinction voltages).
- Thermal requirements - thermal resistances and transient thermal impedance (Zth), plus measurement points for case and substrate temperatures.
- Measurement methods - standardised test methods for:
- Isolation breakdown / high‑pot testing,
- Partial discharge measurement (per IEC 60270 reference),
- Measurement of Lp and Cp,
- Thermal characteristic measurements and peak case non‑rupture current tests.
- Acceptance, reliability and endurance tests - defines endurance test lists, acceptance criteria, and distinguishes type tests and routine tests required for product qualification.
- Document changes - re‑editing of clauses 3–5, revised measuring methods (clauses 6–7), amendments to clause 8, and deletion of Annex C/D and bibliography vs previous edition.
Practical applications
This standard is directly applicable to designers, manufacturers and test laboratories working with:
- Isolated power modules and discrete devices used in power supplies, inverters, motor drives, EV power electronics, renewable energy converters and medical/industrial equipment where mains or safety isolation is required.
- Components where isolation to baseplate or casing is a critical safety or functional parameter.
Who should use EN 60747-15:2012
- Semiconductor design and test engineers
- Quality, compliance and certification teams
- Independent test labs performing high‑pot, partial discharge and thermal tests
- Procurement and regulatory professionals assessing component suitability for safety‑critical designs
Related standards
- IEC/EN 60747-1 (General requirements)
- Other IEC 60747 parts for specific device types (IGBTs, diodes, transistors)
- IEC 60270 (Partial discharge techniques), IEC 60664-1 (Insulation coordination) and IEC 60749 series (mechanical/climatic tests)
Keywords: EN 60747-15:2012, isolated power semiconductor devices, isolation voltage, partial discharge, parasitic inductance, parasitic capacitance, thermal impedance, semiconductor device standards.