EN IEC 61760-4:2026 PDF

Overview

EN IEC 61760-4:2026, published by CLC, addresses requirements for surface mounting technology with a specific focus on the classification, packaging, labelling, and handling of moisture sensitive devices (MSDs). As electronic assemblies evolve and lead-free, high-temperature soldering processes become ubiquitous, controlling and mitigating moisture sensitivity is increasingly critical for device reliability and manufacturing yield. This standard establishes a systematic approach for manufacturers and users of surface mount devices (SMDs) to assess, manage, and communicate moisture-related risks across the electronics manufacturing supply chain.