IEC 60191-6-5:2001 PDF

Overview

IEC 60191-6-5:2001 is an International Electrotechnical Commission (IEC) standard focusing on the mechanical standardization of semiconductor devices. Specifically, this part of IEC 60191 addresses the general rules for the preparation of outline drawings of surface mounted semiconductor device packages, serving as a design guide for fine-pitch ball grid array (FBGA) components. The standard applies to FBGA packages with a terminal pitch of less than or equal to 0.80 mm, supporting the need for high-density, high-performance, and multi-functional electronic equipment with area array packaging styles.

By providing standardized outline drawings and critical dimensions for all types of FBGA package structures and materials, IEC 60191-6-5:2001 enhances interchangeability and consistency in the electronics industry.

Key Topics

• Scope and Definitions

  • Defines the range of the standard: square-outline FBGA packages with terminal pitches ≤ 0.80 mm.
  • Clarifies package structure types, such as flanged types and real chip size types.
  • Designations for FBGA materials: plastic type (P-FBGA) and ceramic type (C-FBGA).

• Standardized Outline Drawings

  • Outlines rules for creating physical outline drawings.
  • Covers package body dimensions, terminal pitch, ball matrix configurations, and seating plane definitions.

• Dimensional Guidance

  • Provides dimensional ranges for package body sizes (D and E), package heights, ball diameters, and terminal pitches.
  • Recommends specific values to ensure mounting compatibility and interchangeability.

• Mounting and Interchangeability

  • Details groupings and values for dimensions critical to physical mounting and automated handling.
  • Ensures compatibility with industry-standard printed circuit board (PCB) layouts.

• Material Classifications

  • Describes distinctions between plastic and ceramic FBGA package types, supporting informed material selection in design and manufacturing.

Applications

IEC 60191-6-5:2001 is essential for:

• Semiconductor Manufacturers
  • Facilitates the design and production of consistent, interchangeable FBGA packages that meet international standards.
• PCB Designers and Assemblers
  • Provides reliable outline and dimensional data for accurate footprint design and automated assembly processes.
• Quality Assurance
  • Supports inspection, verification, and acceptance of fine-pitch BGA component packages based on standardized measurements.
• Procurement and Supply Chain
  • Enables clear specification of FBGA package requirements in sourcing documentation and supplier agreements.

Fine-pitch ball grid array packages covered by this standard are widely used in high-density, high-performance electronics such as consumer devices, computing equipment, and telecommunications systems due to their space-saving and electrical performance advantages.

Related Standards

• IEC 60191-6:1990

  • Establishes general rules for the preparation of outline drawings for surface mounted semiconductor device packages.

• IEC 60191 Series

  • A comprehensive set of standards covering the mechanical standardization of semiconductor devices, including various package types and mounting styles.

• Other IEC/ISO Standards

  • Additional relevant international standards may support more specific aspects of electronic packaging, PCB design, and automated manufacturing processes.

By adhering to IEC 60191-6-5:2001, industry stakeholders ensure the mechanical compatibility, reliability, and global interoperability of fine-pitch FBGA packages within the electronics sector. Implementing this standard supports innovation and consistency across international markets.