Overview
IEC 60191-6-6:2001 is an IEC design guide for the mechanical standardization of fine-pitch land grid array (FLGA) surface-mounted semiconductor packages. It defines common outline drawings, dimensional rules and classification for square-bodied FLGA packages whose terminal pitch (e) is ≤ 0.80 mm and whose terminal height is ≤ 100 µm. The standard aims to promote interchangeability and consistent outline documentation for FLGA package families.
Key topics
- Scope and classification
- Applies to square FLGA packages with terminal pitch e = 0.80, 0.65, 0.50, 0.40 mm.
- Material designations: P-FLGA (plastic/interposer resin) and C-FLGA (ceramic).
- Package body types: flanged type and type of real chip size.
- Outline drawing rules
- Defines datums (A, B, primary datum S) and seating plane (by least squares of spherical crowns of terminals) for consistent drawing and measurement.
- Specifies visible index zones, terminal arrays and geometry annotations.
- Dimensional groups and limits
- Grouped dimension tables for: mounting/interchangeability, mounting/gauging, automated handling, and informational dimensions.
- Typical dimensional parameters include body sizes (D, E), terminal pitch (e), terminal diameter/land size (b, b2), offsets (ZD, ZE) and overhang rules.
- Ball/matrix guidance
- Table-based guidance on maximum terminal matrix sizes and recommended matrix families for each pitch (examples for 4×4 up to 26×26 depending on e).
- Purpose
- Standardizes outline drawings to support PCB footprint design, pick-and-place handling, gauging and interchangeability among manufacturers.
Applications
Who uses IEC 60191-6-6 and why:
- Package designers - to create compliant FLGA outline drawings and select matrix/land layouts.
- PCB layout engineers - to design footprints and land patterns compatible with standardized FLGA outlines.
- Assembly/test engineers - to validate mounting/gauging, automated handling and seating plane requirements.
- Procurement / quality teams - to specify interchangeability and acceptance criteria for FLGA components.
- Standards and compliance specialists - for cross-referencing with the IEC 60191 family.
Related standards
- IEC 60191 (all parts) - broader mechanical standardization of semiconductor devices.
- Drafting follows ISO/IEC Directives, Part 3 as noted in the publication.
Keywords: IEC 60191-6-6, FLGA, fine-pitch land grid array, surface mounted semiconductor packages, outline drawings, terminal pitch, P-FLGA, C-FLGA, package interchangeability.