IEC 60749-8:2002 PDF
Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing
Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing
- Статус документа:
- Действующий
- Формат:
- Электронный (PDF)
- Количество страниц:
- 31
- Дата публикации:
- 30 августа 2002 г.
- Издание:
- IEC IS 60749 edition 1 version 1
- ICS:
- 31.080.01
Applicable to semiconductor devices (discrete devices and integrated circuits), it determines the leak rate of semiconductor devices. The contents of the corrigenda of April 2003 and August 2003 have been included in this copy.
Abstract
Overview
IEC 60749-8:2002 is an international standard published by the International Electrotechnical Commission (IEC) that specifies mechanical and climatic test methods focused on the . This standard applies to both discrete semiconductor devices and integrated circuits, ensuring their hermetic sealing integrity under various test conditions. The document consolidates corrigenda from April and August 2003 to provide comprehensive guidance on leak detection methods for semiconductor packages.
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