IEC 61076-4-108:2002 PDF

Overview

IEC 61076-4-108:2002 is an IEC detail specification for printed board cable-to-board connectors with assessed quality (IECQ). It defines mechanical, electrical and EMC-related requirements for connectors having a modular pitch of 25 mm, an applicable transverse packing density of 15 mm, and a basic grid of 2.5 mm in accordance with IEC 60917-1. The publication also appears as IECQ specification QC 480301XX0009 and is intended for manufacturers, testers and designers who require a quality-assured connector family with integrated shielding.

Key topics and requirements

The standard provides comprehensive technical coverage including:

• General data and mounting recommendations (max contacts, mounting methods).
• Dimensional information and detailed drawings for fixed board and free cable connectors, contacts and accessories.
• Mechanical features: engagement/separation direction, coding, latching and retention requirements.
• Electrical characteristics: voltage proof, current carrying capacity, contact and insulation resistance, creepage and clearance.
• Shielding and EMC: integrated shielding function, grounding interfaces and an informative annex on shielding effectiveness.
• Environmental and mechanical tests: climatic categories, vibration, shock, mechanical endurance and flammability.
• Quality assessment procedures: qualification approval testing methods, lot-by-lot and periodic inspection schedules.
• Test schedules and gauges: specific test groupings (dynamic, climatic, mechanical, electrical, chemical, EMC) and test arrangements.

Applications and practical use

IEC 61076-4-108 is used by:

• Connector manufacturers to design and certify cable-to-board product families that meet assessed-quality requirements.
• PCB and system designers specifying connectors for equipment requiring robust shielding and predictable packing density.
• Quality/Compliance teams and procurement to reference accepted tests and IECQ conformity (QC 480301XX0009).
• Test laboratories executing qualification and lot-conformance testing according to the detailed test schedules. Typical applications include backplane and front-panel interconnects in telecom, industrial control, instrumentation and other electronic equipment where controlled mechanical pitch, high packing density and EMC performance are critical.

Related standards

• IEC 60917-1 – basic grid specification referenced for grid/spacing adherence.
• IEC 61076-1 – general requirements for printed board connectors (referenced for assessed quality and detail-specification format).
• IECQ documentation for electronic components of assessed quality (QC numbering and assessment system).

Keywords: IEC 61076-4-108, printed board connectors, cable-to-board connectors, modular pitch 25 mm, shielding, IECQ, transverse packing density 15 mm, IEC 60917-1, connector specification, EMC testing.