Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-501: Test methods for materials for interconnection structures - Measurement of resilience strength and resilience strength retention factor of flexible dielectric materials
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-501: Test methods for materials for interconnection structures - Measurement of resilience strength and resilience strength retention factor of flexible dielectric materials
IEC 61189-2-501:2022 establishes a method suitable for testing the softness of FCCL (Flexible Copper Clad Laminate) products and related materials. This method determines the resilience under specified conditions. The test is performed on the sample as manufactured and without conditioning. The test does not apply to the resilience force lower than 10 mN.
IEC 61189-2-501:2022 is an international standard published by the International Electrotechnical Commission (IEC) that defines test methods for evaluating the mechanical resilience of flexible dielectric materials used in electrical interconnection structures. This part 2-501 standard specifically focuses on measuring the resilience strength and the resilience strength retention factor of flexible copper clad laminates (FCCLs) and similar flexible dielectric materials commonly utilized in printed boards and electronic assemblies.
Designed to assess the softness and mechanical response of FCCL products as manufactured, IEC 61189-2-501 provides a precise, reproducible method to quantify how these materials withstand compression and retain their elasticity without conditioning or aging processes. It excludes tests on samples with resilience force below 10 mN, ensuring the method targets materials relevant for industrial applications.
The IEC 61189-2-501 standard is invaluable for:
Стандарты, упомянутые в описании
IEC 61189-2-501:2022 is part of the broader IEC 61189 series that governs test methods for electrical materials, printed boards, and interconnection assemblies. Related documents in this series cover additional mechanical, physical, and electrical tests such as:
Adoption of IEC 61189-2-501:2022 promotes standardized evaluation of flexible dielectric materials contributing to higher reliability and performance in modern flexible electronics. Its focus on resilience strength measurement underlines the critical role of mechanical properties in the durability and effectiveness of flexible interconnection structures used worldwide.