IEC 61189-2-804:2023 PDF
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300
Название (английский):
IEC 61189-2-804:2023
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300
- Статус документа:
- Действующий
- Формат:
- Электронный (PDF)
- Количество страниц:
- 16
- Дата публикации:
- 25 августа 2023 г.
- Издание:
- IEC IS 61189 edition 1 version 1
- ICS:
- 31.180
Описание (английский):
IEC 61189-2-804:2023 specifies a test method to determine the time to delamination of base materials and printed boards using a thermomechanical analyser (TMA). Temperatures used for this evaluation are typically 260 °C, 288 °C and 300 °C, but are not limited to these values.
Технические детали
- Технический комитет
- TC 91 - Electronics assembly technology
- SKU
- IEC 61189-2-804:2023