IEC 61192-2:2003 PDF
Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies
Название (английский):
IEC 61192-2:2003
Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies
- Статус документа:
- Отменён
- Формат:
- Электронный (PDF)
- Количество страниц:
- 127
- Дата публикации:
- 14 марта 2003 г.
- Издание:
- IEC IS 61192 edition 1 version 1
- ICS:
- 31.190
Описание (английский):
Specifies requirements for workmanship in soldered surface-mounted electronic assemblies and multichip modules on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. Applies to assemblies that are totally surface-mounted and to the surface-mount portions of assemblies that include other related assembly technologies, for example, through-hole mounting.
Технические детали
- Технический комитет
- TC 91 - Electronics assembly technology
- SKU
- IEC 61192-2:2003