IEC 61249-2-26:2005 PDF

Overview

IEC 61249-2-26:2005 specifies international requirements for non-halogenated epoxide reinforced base materials used in printed circuit boards (PCBs) and other interconnecting structures. This standard focuses on non-woven/woven E-glass reinforced laminated sheets, copper-clad and of defined flammability, tested by vertical burning methods. The materials covered range in thickness from 0.80 mm to 1.60 mm and emphasize environmentally friendly, flame-retardant properties achieved without halogenated compounds. The glass transition temperature (Tg) must be at least 95 °C to ensure thermal stability in electronic applications.

Key Topics

• Material Composition: Specifies resin systems using non-halogenated epoxide and inorganic/organic fire retardants integrated within the polymer matrix or as additives. Reinforcement consists of E-glass fibers, supplied as woven or non-woven fabrics.
• Flammability Requirements: Defines performance criteria based on vertical burning tests that ensure fire safety without relying on halogenated flame retardants.
• Copper Cladding: Standards for laminated sheets with copper foil that meet adhesion, thickness, and electrical property specifications critical to PCB reliability.
• Electrical and Mechanical Properties: Defines minimum electrical insulation, flexural strength, dimensional stability, and resistance to moisture absorption.
• Quality Assurance: Covers manufacturing quality systems, inspection protocols, qualification controls, and certification to ensure materials meet specification during production.
• Marking and Packaging: Requirements for internal marking to identify batch and material, as well as packaging methods to maintain product integrity.

Applications

The IEC 61249-2-26 standard is essential for manufacturers, designers, and quality engineers involved in:

• Printed Circuit Board Fabrication: Providing environmentally sustainable, flame-retardant base materials with consistent mechanical and electrical characteristics.
• High-Reliability Electronics: Used in automotive, industrial, and telecommunications sectors where fire safety and material stability under thermal stress are priorities.
• Interconnecting Structures: Beyond PCBs, suitable for multilayer laminates and substrates used in complex electronic assemblies.
• Compliance and Procurement: Ensures suppliers provide materials that meet international fire, electrical, and mechanical performance standards required for global market access.

Related Standards

• IEC 61249 Series: Covers various reinforced base materials and laminated sheets for printed boards, addressing halogenated and non-halogenated epoxy systems.
• UL 94: For flammability classification of plastics used in devices and appliances, complementary to vertical burning tests in IEC 61249-2-26.
• IPC Standards: Provide guidelines on PCB fabrication processes where materials specified in IEC 61249-2-26 are applied.
• RoHS Directive: Supports the use of non-halogenated materials to comply with hazardous substance regulations in electronics.
• IEC 60034-1: Sample of IEC standards renumbered in the 60000-series, illustrating international harmonization of electrotechnical standards.

Keywords: IEC 61249-2-26, non-halogenated epoxide, E-glass reinforced laminate, printed circuit board materials, copper-clad laminates, flame retardant PCB materials, vertical burning test, glass transition temperature, electrical insulation, PCB substrate standards, fire safety electronics, environmental compliance materials.