IEC 61249-2-44:2016 PDF
Materials for printed boards and other interconnecting structures - Part 2-44: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
Materials for printed boards and other interconnecting structures - Part 2-44: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
- Статус документа:
- Действующий
- Формат:
- Электронный (PDF)
- Количество страниц:
- 42
- Дата публикации:
- 12 мая 2016 г.
- Издание:
- IEC IS 61249 edition 1 version 1
- ICS:
- 31.180
IEC 61249-2-44:2016 gives requirements for properties of non-halogenated epoxide non-woven reinforced core/woven E-glass reinforced surface laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly in thicknesses of 0,60 mm up to 1,70 mm. The flammability rating is achieved through the use of non-halogenated fire retardants reacted as part of the epoxide polymeric structure. The glass transition temperature is defined to be 105 °C minimum.
Abstract
Overview
IEC 61249-2-44:2016 is an international standard published by the International Electrotechnical Commission (IEC) that specifies the requirements for non-halogenated epoxide reinforced laminate sheets used in printed boards and other interconnecting structures. This standard focuses on laminate sheets that are reinforced with non-woven and woven E-glass, have defined flammability characteristics based on vertical burning tests, and are copper-clad specifically for lead-free assembly processes.
Key attributes include the use of non-halogenated fire retardants incorporated into the epoxide polymer matrix to achieve safety standards for flammability, alongside a minimum glass transition temperature of 105 °C. Available in thicknesses ranging from 0.60 mm to 1.70 mm, these materials cater to modern environmentally conscious electronic manufacturing.
Key Topics
- Material Composition: The standard defines the reinforcement type as non-woven/woven E-glass fabrics embedded in a non-halogenated epoxide resin system.
- Flammability Requirements: Classification is based on vertical burning tests ensuring compliance with fire safety norms without halogenated retardants.
- Copper Cladding: Laminate sheets are copper-clad to support lead-free solder assembly processes, addressing environmental and legislative restrictions such as RoHS compliance.
- Mechanical and Physical Properties: Specifications include laminate thickness, bow and twist limits, pull-off and peel strength of the copper foil, dimensional stability, as well as flexural strength and water absorption characteristics after foil removal.
- Thermal Performance: A crucial requirement is a minimum glass transition temperature (Tg) of 105 °C, ensuring reliability under thermal stress. The decomposition temperature and time to delamination (TMA) are also detailed.
- Quality Assurance and Testing: The standard outlines inspection responsibilities, qualification, conformance inspections, and requirements for certification and marking.
- Packaging and Ordering: Guidelines for proper packaging, marking, and ordering information aim to facilitate supply chain integrity and traceability.
Applications
IEC 61249-2-44 materials are essential in the manufacture of printed circuit boards (PCBs) and other electrical interconnecting structures where high reliability, fire safety, and environmental compliance are crucial. Typical applications include:
- Lead-free electronic assemblies where halogen-free materials are preferred for environmental and health reasons.
- Consumer electronics, automotive, telecommunications, and industrial electronics that require laminated base materials with defined flammability.
- PCBs subjected to thermal stress demanding materials with high glass transition temperatures for performance stability.
- Electronics designs requiring dimensional stability, rigidity, and strong copper foil adhesion for manufacturing precision and durability.
Related Standards
IEC 61249-2-44:2016 aligns and complements other standards within the IEC and international standardization ecosystem, such as:
- IEC 61249 Series - Covers various reinforced base materials including halogenated and non-halogenated epoxides for printed boards.
- IPC Standards - Including IPC-4101 which details base materials for printed boards with similar testing for flammability and mechanical properties.
- RoHS and REACH Regulations - Although not standards, compliance with these environmental regulations is supported by the non-halogenated nature of IEC 61249-2-44 materials.
By adhering to IEC 61249-2-44, manufacturers ensure that electronic materials meet stringent international requirements for safety, performance, and environmental sustainability.
Keywords: IEC 61249-2-44, non-halogenated epoxide laminate, E-glass reinforced laminate, copper-clad laminate, lead-free assembly materials, printed circuit board materials, vertical burning test, flammability rating, glass transition temperature, PCB base materials, environmental compliance, electrical insulation materials, laminated sheets for electronics.
Технические детали
- Технический комитет
- TC 91 - Electronics assembly technology
- SKU
- IEC 61249-2-44:2016
Похожие стандарты
Упомянутые в описании и другие стандарты IEC
BS EN IEC 61249-2-46:2018
ДействующийMaterials for printed boards and other interconnecting structures - Reinforced base materials clad and unclad…
What is BS EN IEC 61249-2-46 - Materials for printed boards about? BS EN IEC 61249-2-46 is an international standard that discusses materials for printed boards and other interconnecting structures.…
IEC 60050-161:1990/AMD2:1998
ДействующийAmendment 2 - International Electrotechnical Vocabulary (IEV) - Part 161: Electromagnetic compatibility
IEC 60050-161:1990/AMD2:1998 – Electromagnetic Compatibility Vocabulary Amendment ### Overview The IEC 60050-161:1990/AMD2:1998 is the second amendment to the International Electrotechnical Vocabular…