IEC 62047-10:2011 PDF
Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials
Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials
- Статус документа:
- Действующий
- Формат:
- Электронный (PDF)
- Количество страниц:
- 22
- Дата публикации:
- 26 июля 2011 г.
- Издание:
- IEC IS 62047 edition 1 version 1
- ICS:
- 31.080.99
IEC 62047-10:2011 specifies micro-pillar compression test method to measure compressive properties of MEMS materials with high accuracy, repeatability, and moderate effort of specimen fabrication. The uniaxial compressive stress-strain relationship of a specimen is measured, and the compressive modulus of elasticity and yield strength can be obtained. This standard is applicable to metallic, ceramic, and polymeric materials. The contents of the corrigendum of February 2012 have been included in this copy.
Abstract
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