IEC 62047-43:2024 PDF

Overview

IEC 62047-43:2024 specifies a standardized test method for electrical characteristics after cyclic bending deformation of flexible micro‑electromechanical devices (flexible MEMS). The scope covers passive and active micro components on or embedded in flexible films. Typical device sizes for the procedure range from about 1 mm to 300 mm in-plane and thicknesses from 10 μm to 1 mm (not limiting). The method characterizes performance degradation as a function of bending severity and number of cycles using a 3‑D P‑S‑N (Performance‑Severity‑Number of cycles) plot, enabling estimation of safety margin and lifetime under repeated bending.

Key topics and requirements

• Test principle: Cyclic folding between two loading walls to impose controlled bending (folding distance, dmin/dmax) and generate P‑S‑N data.
• Test piece preparation: Guidance on using intact flexible MEMS or cutting to a rectangular test piece with the target functional area centrally located.
• Bending parameters: Definition and measurement of folding distance, shuttle range, and optional conversion to nominal radius or bending strain.
• Selection of bending direction and axes: Procedures for choosing bending directions and locating bending axes relevant to device geometry and function.
• Apparatus & instrumentation: Requirements for mechanical fixtures, moving walls, and electrical measurement equipment to record device electrical characteristics during/after cyclic loading.
• Test procedure: Specified testing conditions, number of cycles, measurement intervals, and end‑of‑test criteria to document degradation trends.
• Reporting: Required test report items including bending directions, test piece dimensions, testing conditions, and performance degradation characteristics plotted against folding distance and cycle count.

Applications

IEC 62047-43:2024 is directly applicable to:

• Design validation and reliability assessment of flexible sensors, actuators, and printed electronics.
• Qualification of components for wearables, foldable displays, IoT devices, and flexible medical sensors subject to repeated bending.
• Failure‑mode analysis and lifetime prediction using the P‑S‑N framework to understand trade‑offs between bending severity and service life.
• Supplier and product qualification tests used by manufacturers and test laboratories to define safety margins and maintenance/usage recommendations.

Who should use this standard

• MEMS and flexible electronics designers and reliability engineers
• Test laboratories and QA teams performing mechanical‑electrical endurance testing
• Manufacturers of flexible sensors, printed circuits, wearable devices, and foldable products
• R&D teams developing new flexible micro‑electromechanical devices

Related standards

• IEC 62047-35:2019 - Test method of electrical characteristics under bending deformation for flexible electro‑mechanical devices.
• Other parts of the IEC 62047 series covering MEMS test methods and terminology.

Keywords: IEC 62047-43:2024, flexible MEMS, cyclic bending test, folding distance, P‑S‑N plot, bending deformation, electrical characteristics, reliability testing, flexible micro‑electromechanical devices.