Overview
IEC 62137-1-5:2009 is an international standard developed by the International Electrotechnical Commission (IEC) that focuses on testing methods for surface mount solder joints used in electronics assembly. Specifically, this part of the standard addresses the mechanical shear fatigue test for solder joints in area array packages such as Ball Grid Arrays (BGA). It provides a methodology to evaluate the fatigue life and mechanical reliability of solder joints subjected to cyclic shear deformation, simulating repeated stress conditions experienced in real-world electronic applications. This mechanical approach offers an accelerated testing alternative to the traditional temperature cycling (thermal fatigue) method by applying direct mechanical displacement to assess solder joint endurance.
Key Topics
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Scope and Application
The standard applies to solder joints formed between component leads and substrate lands in area array packages. It focuses on evaluating solder joint durability without measuring the strength of the whole electronic component.
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Test Methodology
- Uses a mechanical shear fatigue test to impose cyclic shear deformation on solder joints until fracture occurs.
- Provides an accelerated alternative to thermal cycling by applying mechanical displacement that replicates strain caused by coefficient of thermal expansion (CTE) mismatch.
- Soldered assemblies are first prepared by reflow soldering according to industry best practices before testing.
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Test Equipment and Materials
- Utilizes tension-compression testing machines equipped with shear fatigue jigs for applying mechanical shear loads.
- Requires standardized substrates, solder alloys, and solder paste materials compliant with related IEC specifications.
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Test Conditions and Procedures
- Covers pre-treatment steps, test sequences, ramp rates (velocity of mechanical displacement), and displacement ranges.
- Angles and forces involved are carefully controlled to ensure repeatability and reliability of results.
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Evaluation Metrics
- Fatigue life is determined by the number of shear cycles endured before joint fracture.
- Reaction forces at maximum and minimum test positions are analyzed to characterize joint strength.
- Results help in assessing the impact of solder alloy composition, substrate design, and component type on reliability.
Applications
IEC 62137-1-5:2009 is highly valuable for:
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Electronic Component Manufacturers
Assessing and improving solder joint robustness in area array packages to enhance product reliability under mechanical and thermal stresses.
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Printed Circuit Board (PCB) Designers and Assemblers
Validating solder joint durability for various substrate materials and assembly processes, ensuring long-term electronic assembly endurance.
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Quality Assurance and Testing Laboratories
Implementing standardized mechanical shear fatigue tests to certify solder joint quality and predict lifecycle performance without lengthy temperature cycling.
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Research and Development
Studying the mechanical behavior of novel solder alloys-including lead-free compositions-and investigating their fatigue characteristics.
This standard helps accelerate the qualification process for surface-mounted electronic assemblies by providing reliable, reproducible mechanical test methods that represent real-life service stresses.
Related Standards
IEC 62137-1-5:2009 should be considered alongside these related IEC standards which complement its scope:
- IEC 60068-1 – Environmental Testing: General guidance and principles for environmental and endurance tests.
- IEC 62137 (series) – Covers environmental and endurance test methods for surface mount solder joints beyond mechanical fatigue, including thermal and environmental stresses.
- IEC 61190-1-2 and IEC 61190-1-3 – Specifications for solder pastes and solder alloys used in electronic assembly, relevant for materials used in tests.
- IEC 60194 and IEC 61188-5 – Definitions and design guidelines for printed boards and printed board assemblies.
- IEC 61760-1 – Standard specifying surface mount components, relevant for preparing test samples.
- IEC 60068-2-21 – Mechanical robustness of soldered electrical and electronic components mounted on printed boards, focused on different mechanical test methods.
By integrating the mechanical shear fatigue test method with these standards, organizations can comprehensively assess and enhance the reliability of surface mount solder joints.
Keywords: IEC 62137-1-5, mechanical shear fatigue test, surface mount technology, solder joint reliability, BGA solder testing, area array packages, surface mount solder joints, mechanical fatigue testing, electronics assembly testing, solder joint endurance, accelerated solder joint testing, solder alloy evaluation, IPC standards, environmental endurance tests.