IEC 62739-3:2017 PDF

Name: IEC 62739-3:2017 — Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 3: Selection guidance of erosion test methods
SKU: IEC 62739-3:2017
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Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 3: Selection guidance of erosion test methods

Название (английский):

IEC 62739-3:2017

Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 3: Selection guidance of erosion test methods

Статус документа:: Действующий
Формат:: Электронный (PDF)
Количество страниц:: 32
Дата публикации:: 6 января 2017 г.
Издание:: IEC IS 62739 edition 1 version 1
ICS:: 01

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Описание (английский):

IEC 62739-3:2017 describes the selection methodology of an appropriate evaluating test method for the erosion of the metal materials without or with surface processing intended to be used for lead-free wave soldering equipment as a solder bath and other components which are in contact with the molten solder.

Abstract

Похожие стандарты

Стандарты, упомянутые в описании

Overview

IEC 62739-3:2017 - "Test method for erosion of wave soldering equipment using molten lead‑free solder alloy - Part 3: Selection guidance of erosion test methods" - defines a structured selection methodology for choosing appropriate laboratory test methods to evaluate erosion of metal materials (with or without surface processing) used in lead‑free wave soldering equipment (solder baths and components in contact with molten solder).

This part of the IEC 62739 series helps users map real-world stresses in wave soldering to accelerated erosion tests and choose the right test conditions and measurement methods.

Key topics and technical requirements

Selection methodology: Guidance to correlate field stresses (temperature, flow, contact dynamics, dross) with laboratory test methods.

Test method overview: References to specific accelerated tests - e.g., rotation tests commonly specified at 350 °C (for unprocessed metals) and 450 °C (for surface‑processed materials), including options with 2 mm bending to simulate mechanical stresses.

Common test items:

Specimen preparation and surface processing considerations.
Solder alloy selection consistent with IEC 61190‑1‑3 (electronic grade lead‑free solders).
Accelerated stress parameters: test temperature, rotation speed, immersion time and bending stress.
Dross management: generation intervals, removal methods and remaining molten solder volume after dross removal.
Erosion depth measurement: post‑test treatment, local (focal) vs general (uniform) erosion depth assessment and evaluation regions.

Supportive annexes: guidance on selecting test temperature, duration and bending stress; measurement techniques and accuracy; erosion mechanisms; and thermal acceleration behavior.

Practical applications and users

This standard is essential for:

Manufacturers of wave solder baths, solder pot components and replacement parts (material selection and lifetime prediction).

Materials suppliers and surface‑treatment providers (stainless steels, nitriding, coatings) validating corrosion/erosion resistance to lead‑free molten solder.

Reliability and process engineers in electronics assembly seeking to specify or evaluate component longevity under wave‑solder conditions.

Independent test laboratories performing accelerated erosion testing and quality assurance.

Procurement and conformity teams requiring standardized test selection for supplier qualification.

Related standards

IEC 62739‑1:2013 - erosion test method for metals without surface processing

IEC 62739‑2 - erosion test method for metals with surface processing

IEC 61190‑1‑3 - requirements for electronic grade lead‑free solder alloys

IEC 60068‑2‑20 - solderability and resistance to soldering heat tests

Keywords: IEC 62739-3, erosion test, wave soldering, lead-free solder, solder bath, rotation test, dross management, erosion depth measurement, surface processing.

IEC 62739-3:2017 PDF

Abstract

Похожие стандарты

Overview

Key topics and technical requirements

Practical applications and users

Related standards

Технические детали

IEC 62739-1:2013

Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1: Erosion tes…

IEC 62739-2:2016

Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 2: Erosion tes…

BS EN IEC 61190-1-3:2018

Attachment materials for electronic assembly - Requirements for electronic grade solder alloys and fluxed and…

IEC 60068-2-20:2021

Environmental testing - Part 2-20: Tests - Test Ta and Tb: Test methods for solderability and resistance to s…