IEC 62899-202-8:2024 PDF

Overview

IEC 62899-202-8:2024 is an IEC international standard in the Printed Electronics series that specifies a method to measure the difference in electrical resistance with respect to printing direction for conductive films made from wire-shaped (high aspect‑ratio) conducting materials. It covers solution-processed conductive films fabricated by coating and printing processes and is intended to quantify resistance anisotropy that arises from alignment of wire-shaped materials (e.g., metal nanowires) during printing.

Key topics and technical requirements

• Scope: Measurement of resistance difference by printing direction for wire-shaped/wire-type conductive materials in printed conductive films.
• Measurement environment: Tests are carried out at 23 °C ± 1 °C and relative humidity 50 % ± 5 %, with atmospheric pressure per ISO 291.
• Measurement method: Four‑wire (Kelvin) resistance measurement is required to minimise lead/contact errors.
• Resistance ranges and applied currents: The standard references resistance ranges mapped to test currents (examples include 1 A for