IEC PAS 63702:2026 PDF
Classification of additive manufacturing and 3D-printing processes for electronics
Classification of additive manufacturing and 3D-printing processes for electronics
- Статус документа:
- Действующий
- Формат:
- Электронный (PDF)
- Количество страниц:
- 29
- Дата публикации:
- 16 июня 2026 г.
- Издание:
- IEC PAS 63702 edition 1 version 1
- ICS:
- 31.190
IEC PAS 63702:2026 describes the classification of additive manufacturing and 3D-printing processes for electronics.
Abstract
Overview
IEC PAS 63702:2026, developed by the International Electrotechnical Commission (IEC), presents a comprehensive classification for additive manufacturing (AM) and 3D printing processes specifically for electronics. As the electronics industry demands greater miniaturization and higher performance, AM technologies are increasingly vital. This standard provides foundational terminology, structure, and classification to facilitate universal understanding and application of AM processes within the electronics sector.
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