IEC TR 60068-3-15:2024 PDF

Name: IEC TR 60068-3-15:2024 — Environmental testing - Part 3-15: Supporting documentation and guidance - Vacuum-assisted reflow soldering
SKU: IEC TR 60068-3-15:2024
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Environmental testing - Part 3-15: Supporting documentation and guidance - Vacuum-assisted reflow soldering

Название (английский):

IEC TR 60068-3-15:2024

Environmental testing - Part 3-15: Supporting documentation and guidance - Vacuum-assisted reflow soldering

Статус документа:: Действующий
Формат:: Электронный (PDF)
Количество страниц:: 27
Дата публикации:: 6 февраля 2024 г.
Издание:: IEC TR 60068 edition 1 version 1
ICS:: 19.040

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Описание (английский):

IEC TR 60068-3-15:2024 describes vacuum-assisted soldering considering the thermal profiling, soldering methods, suitability of the components and vacuum features of soldering systems. It is based on practical experiences from manufacturers, component, material, and soldering systems suppliers. It supports manufacturers by providing information about the functionality of vacuum and effect of vacuum on components performance.

Abstract

Похожие стандарты

Упомянутые в описании и другие стандарты IEC

Overview

IEC TR 60068-3-15:2024 is a Technical Report from the IEC that provides supporting documentation and guidance for vacuum-assisted reflow soldering. It synthesizes practical experience from manufacturers, component and material suppliers, and soldering-system vendors to explain how vacuum integrates with reflow processes (convection, vapour phase, contact) and how it affects solder joint quality and component performance. The report is intended to help electronics assemblers and designers understand the functionality of vacuum, thermal profiling, and vacuum equipment features when targeting reduced voiding, improved thermal management, or hermetic sealing.

Key topics and technical requirements

Voids in solder joints: classification of macro-voids, causes, and the impact of voiding on solder joint reliability. (References to industry classifications such as IPC-7095 and IEC TR 61191-8 are noted.)

Vacuum-assisted soldering processes: combinations of reflow techniques with vacuum (convection with vacuum, vapour phase with vacuum, contact soldering with vacuum) and typical temperature–pressure–time curves.

Thermal profiling under vacuum: guidance on how vacuum interacts with thermal profiles and process timing to achieve consistent reflow and mitigate voids.

Vacuum parameters and physical basics: influence of pressure, time, and vapour pressures (outgassing) on soldering outcomes and component integrity.

Component suitability and failure modes: effects of pressure differentials on sensitive components (blow holes, gas bubbles, housing bursts, bulging electrolytics), and how vacuum ramping strategies can reduce risks.

Vacuum equipment constraints: practical considerations such as chamber size, time-to-vacuum, and cycle-time impacts on throughput and process control.

Typical defects: descriptions and images of defects associated with vacuum-assisted reflow - bridging, splattering, component drop/shift, and explosive outgassing - and mitigation approaches (e.g., stepwise vacuum application).

Practical applications and target users

Electronics assemblers and contract manufacturers seeking to reduce voiding in BGAs, QFNs, LEDs, and power components.

OEM design and process engineers specifying thermal profiles and component compatibility for vacuum reflow.

Quality, reliability, and failure-analysis teams evaluating solder-joint performance and hermeticity.

Solder paste, flux, and equipment suppliers optimizing materials and vacuum-capable reflow ovens.

Industries requiring high thermal or RF performance, hermetic sealing, or tight void specifications (e.g., aerospace, medical, power electronics).

Related standards and guidance

IEC TR 61191-8 (solder joint inspection/voids) and IPC-7095 (design/implementation guidance for BGA assemblies) are relevant references for void definitions and acceptance criteria.

ISO 857‑2 provides the baseline definition for reflow soldering (liquidus ≤ 450 °C).

IEC TR 60068-3-15 is a practical resource for implementing vacuum reflow soldering reliably while balancing process capability, component suitability, and equipment limitations.

IEC TR 60068-3-15:2024 PDF

Abstract

Похожие стандарты

Overview

Key topics and technical requirements

Practical applications and target users

Related standards and guidance

Технические детали

BS ISO 857-2:2005

Welding and allied processes. Vocabulary - Soldering and brazing processes and related terms

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