IEC TR 60286-7:2019 PDF

Name: IEC TR 60286-7:2019 — Packaging of components for automatic handling - Part 7: Introduction of a bulk blister pack for miniaturized components
SKU: IEC TR 60286-7:2019
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Packaging of components for automatic handling - Part 7: Introduction of a bulk blister pack for miniaturized components

Название (английский):

IEC TR 60286-7:2019

Packaging of components for automatic handling - Part 7: Introduction of a bulk blister pack for miniaturized components

Статус документа:: Действующий
Формат:: Электронный (PDF)
Количество страниц:: 24
Дата публикации:: 14 октября 2019 г.
Издание:: IEC TR 60286 edition 1 version 1
ICS:: 31.020

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Описание (английский):

IEC TR 60286-7:2019 contains information about the introduction of an innovative bulk blister packing system for miniaturized components, for example chip type components of size 1005 (metric) and smaller. It includes a proposal for standardization of the interface between the packaging and automatic assembly systems and requirements to the properties of the packaging.

Abstract

Похожие стандарты

Упомянутые в описании и другие стандарты IEC

Overview

IEC TR 60286-7:2019 presents a pivotal advancement in the packaging of electronic components for automatic handling. This technical report introduces an innovative bulk blister pack system specifically designed for miniaturized components, such as chip-type parts measuring 1005 (metric) and smaller. Recognizing the growing challenges in packaging ultra-small components, this report proposes standardized guidelines governing the interface between packaging and automatic assembly systems, as well as requisite packaging properties to optimize handling and assembly efficiency.

The International Electrotechnical Commission (IEC) developed this report based on extensive pilot projects, aiming to address the critical need for improved bulk packaging solutions that support automation and minimize component damage or misplacement during automatic handling processes.

Key Topics

Miniaturized component challenges: The report outlines the difficulties posed by the miniaturization of components, which leads to a disproportionally large packaging volume relative to component size, especially in tape and reel formats. This results in inefficiencies and handling risks during assembly.

Limitations of existing bulk feeding systems: Current linear bulk feeding methods face multiple constraints, including the necessity for tight tolerances, sensitivity to component thickness variation, inability to handle cubical components, complex cleaning procedures, and risks of mixing different components.

Bulk blister pack concept: The core innovation is a blister pack with an arrangement of pockets, including five filled pockets, one empty pocket for handling safety, and a smaller pocket for orientation or test samples. The blister pack uses plastic domes to securely hold miniaturized components while enabling automatic feeding.

Design and dimensions: Detailed specifications address the structural design of blister pockets, sealing methods, identification and labeling, and overall dimensions to ensure compatibility with automated assembly interfaces.

Material and electrostatic considerations: Selection of packaging materials focuses on durability and electrostatic discharge (ESD) protection to safeguard sensitive miniaturized components during storage and handling.

Innovative bulk feeding systems: The report highlights new bulk feeding mechanisms compatible with the proposed blister packs, enabling more reliable, efficient, and standardized pick-and-place operations.

Applications

Automated electronic assembly: Enables efficient feeding and handling of ultra-small chip components in high-speed surface mount technology (SMT) and other automated assembly lines.

Miniaturized component packaging: Supports manufacturers who require packaging solutions that reduce volume and minimize component damage while facilitating automation.

Supply chain and logistics: Improves packaging design for transport and storage, reducing component mix-ups and increasing traceability via integrated labeling.

Component testing and quality control: The inclusion of designated pockets for test samples enhances inspection and quality assurance processes within the production workflow.

Related Standards

IEC 60286 series: The bulk blister pack standard is part 7 of the IEC 60286 series that covers the packaging of components for automatic handling, providing harmonized methods and interfaces for automatic assembly.

IEC 60286-3: Defines terms related to packaging, which supports the consistent understanding of concepts used in this report.

Electrostatic protection standards: While not normative here, IEC TR 60286-7 emphasizes electrostatic properties aligning with broader ESD control standards to prevent damage to vulnerable components.

IEC TR 60286-7:2019 represents a critical step toward modernizing packaging technology for miniaturized electronic components. By standardizing bulk blister pack designs and interfaces, it enables higher automation efficiency and protection, addressing longstanding challenges in the electronics manufacturing industry. This progress is essential for manufacturers striving for precision, reliability, and cost-effectiveness in component packaging and automatic handling systems.

IEC TR 60286-7:2019 PDF

Abstract

Похожие стандарты

Overview

Key Topics

Applications

Related Standards

Технические детали

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