IEC TR 61189-3-914:2017 PDF

Name: IEC TR 61189-3-914:2017 — Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-914: Test method for thermal conductivity of printed circuit boards for high-brightness LEDs - Guidelines
SKU: IEC TR 61189-3-914:2017
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-914: Test method for thermal conductivity of printed circuit boards for high-brightness LEDs - Guidelines

Название (английский):

IEC TR 61189-3-914:2017

Статус документа:: Действующий
Формат:: Электронный (PDF)
Количество страниц:: 24
Дата публикации:: 17 марта 2017 г.
Издание:: IEC TR 61189 edition 1 version 1
ICS:: 11.040.50

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Цена:360 €

Описание (английский):

IEC TR 61189-3-914:2017(E) specifies the detailed procedures and precautions for IEC 61189-3-913.

Abstract

Похожие стандарты

Стандарты, упомянутые в описании

Overview

IEC TR 61189-3-914:2017 is an International Electrotechnical Commission (IEC) Technical Report that specifies detailed procedures and precautions for measuring the thermal conductivity of printed circuit boards (PCBs) used in high-brightness LEDs. As a supplement to IEC 61189-3-913, this guideline ensures reliable thermal performance testing, which is essential for the optimal function and longevity of electronic assemblies where heat dissipation is a critical factor. The standard is intended for manufacturers, testing laboratories, and quality assurance teams involved with electrical materials, printed boards, and interconnection assemblies.

Key Topics

Thermal Conductivity Measurement: The guideline provides defined approaches for measuring both in-plane and through-thickness thermal resistance of PCB materials specific to high-brightness LED applications.

Test Conditions: Standardized environmental conditions-such as temperature, humidity, and atmospheric pressure-are specified to ensure test consistency and repeatability.

Specimen Preparation: Guidance is offered on specimen pre-conditioning, die attach using metal paste, wire bonding, and sensor calibration.

Testing Equipment: Recommendations include the use of specific thermal test chambers (as described in EIA/JEDEC STD 51-2), TEG (Test Equipment Group) chips to simulate LED heat sources, and methods for arrangement within test apparatus.

Calculation Methods: The standard details how to obtain values for thermal resistance (both plane-wise and through thickness) and the transformation of these results into relevant parameters such as heat transfer coefficients and thermal conductivity.

Quality Assurance: Emphasis is placed on minimizing measurement variability, controlling environmental factors, and ensuring accurate, repeatable results.

Classification and Application: Annexes provide a framework for classifying PCBs by thermal properties and demonstrate mapping of thermal conductivity and heat transfer coefficient relevant to PCB base materials.

Applications

IEC TR 61189-3-914:2017 is highly relevant in the following contexts:

High-Brightness LED Lighting: Ensures reliable thermal management for PCBs in LED luminaires, enhancing performance and service life.

PCB Manufacturing: Supports quality control processes by delivering standardized test methods for evaluating heat dissipation capabilities.

R&D and New Product Introduction: Assists engineers in selecting or developing PCB materials with optimal thermal characteristics for high-power electronic assemblies.

Testing Laboratories: Provides a reference framework for conducting comparative thermal conductivity measurements, reducing uncertainty and variability between different organizations or operators.

Supplier and Customer Agreements: Offers a classification system based on thermal performance, facilitating clear communication and specification compliance among stakeholders.

Related Standards

IEC 61189-3-913: Main test method for measuring thermal conductivity of electronic circuit boards for high-brightness LEDs; IEC TR 61189-3-914 provides supplementary guidelines and precautions.

IEC 60194: Covers terminology related to printed board design, manufacture, and assembly.

IEC 60068-1:2013: Outlines general requirements and guidance for conducting environmental testing, ensuring standardized test atmospheres.

EIA/JEDEC STD 51-2: Describes environmental conditions for integrated circuit thermal testing in natural convection (still air) environments.

Implementing IEC TR 61189-3-914:2017 enables organizations to accurately assess and classify the thermal performance of printed circuit boards in high-brightness LED applications, supporting product safety, reliability, and long-term performance in demanding electronic systems. Adherence to these guidelines also promotes consistency across global supply chains and enhances the comparability of test results within the electronics industry.

IEC TR 61189-3-914:2017 PDF

Abstract

Похожие стандарты

Overview

Key Topics

Applications

Related Standards

Технические детали

IEC 60068-1:2013

Environmental testing - Part 1: General and guidance

IEC 61189-3-913:2016

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - P…

IEC 60194:2015

Printed board design, manufacture and assembly - Terms and definitions