Overview
IEC TR 62240-2:2018 - "Process management for avionics – Electronic components capability in operation – Part 2: Semiconductor microcircuit lifetime" is a technical report that provides a structured process and practical method for assessing the lifetime of COTS semiconductor microcircuits used in aerospace, defence and high performance (ADHP) applications. The report targets OEMs and supports the preparation and maintenance of the Electronic Component Management Plan (ECMP) to ensure selected digital semiconductor microcircuits meet long‑term mission lifetime requirements.
Key topics and requirements
- Scope and focus
- Applies mainly during electronic design and component selection.
- Emphasis on intrinsic wear‑out and lifetime for deep sub‑micron (DSM) devices (≤ 90 nm feature size).
- Packaging wear‑out and random failure mechanisms are explicitly out of scope.
- Lifetime assessment process
- A stepwise process flow for lifetime assessment and COTS selection (see Figure 1 in the report).
- Inputs include OCM (original component manufacturer) data, operating/thermal mission profiles, and technological parameters.
- Physics of Failure (PoF) based risk analysis
- Uses PoF and component family characteristics to identify likely failure and degradation mechanisms.
- Considers new failure modes arising from technology scaling (e.g., FinFET, FD‑SOI, new materials).
- Acceleration models and lifetime calculation
- Guidance on using acceleration models to extrapolate life under mission conditions.
- Assessment paths when OCM lifetime data is unavailable or incomplete.
- Compliance and mitigation
- Methods to determine lifetime compliance for the mission.
- Guidance on mitigation strategies and when to reconsider component choices.
- Deliverables
- Template and content guidance for a final lifetime assessment report (Annex F).
- Informative annexes
- Failure mechanisms (Annex A), mission profile examples (Annex B), risk mapping by device family (Annex C), BEOL/FEOL parameters (Annex D), and example acceleration models (Annex E).
Applications and users
- Primary users: OEMs designing avionics and ADHP systems that integrate COTS semiconductor microcircuits.
- Practical uses:
- Selecting semiconductor microcircuits with demonstrable mission lifetimes.
- Building or updating an ECMP and supplier/OCM data requirements.
- Performing PoF‑based risk assessments, lifetime calculations, and risk mitigation planning for long‑duration platforms (aircraft, defence systems, space/long‑life electronic equipment).
Related standards and guidance
- IEC 62239‑1: supports ECMP creation/maintenance.
- SAE ARP6338: guidance on assessment and mitigation of early wear‑out.
- Notes in IEC TR 62240‑2: MIL‑HDBK‑217 and FIDES are referenced as less appropriate for DSM devices due to scaling‑related wear‑out effects.
Keywords: IEC TR 62240-2, semiconductor microcircuit lifetime, COTS, avionics, OEM, ECMP, lifetime assessment, physics of failure, DSM, reliability, lifetime calculation.