IEC TR 62658:2013 PDF
Roadmap of optical circuit boards and their related packaging technologies
Roadmap of optical circuit boards and their related packaging technologies
- Статус документа:
- Действующий
- Формат:
- Электронный (PDF)
- Количество страниц:
- 19
- Дата публикации:
- 15 июля 2013 г.
- Издание:
- IEC TR 62658 edition 1 version 1
- ICS:
- 33.180.01
IEC/TR 62658:2013(E) covers the roadmap of optical circuit boards, and its related packaging technologies including optical circuit board connectors and optical modules on boards. Keywords: optical packaging technology road map, roadmap of optical circuit boards
Abstract
Overview
IEC TR 62658:2013 provides a comprehensive roadmap for the development and standardization of optical circuit boards and their associated packaging technologies. Published by the International Electrotechnical Commission (IEC), this technical report outlines the technological landscape, performance trends, and relevant supporting components such as optical circuit board connectors and opto-electronic modules. The roadmap aims to support the global transition from conventional electrical printed circuit boards (PCBs) to advanced optical alternatives that meet the escalating demand for higher data transmission rates, energy efficiency, and integration in next-generation networking, server, and data storage applications.
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