IEC TR 62866:2014 PDF
Electrochemical migration in printed wiring boards and assemblies - Mechanisms and testing
Electrochemical migration in printed wiring boards and assemblies - Mechanisms and testing
- Статус документа:
- Действующий
- Формат:
- Электронный (PDF)
- Количество страниц:
- 187
- Дата публикации:
- 7 мая 2014 г.
- Издание:
- IEC TR 62866 edition 1 version 1
- ICS:
- 31.180
IEC TR 62866:2014 describes the history of the degradation of printed wiring boards caused by electrochemical migration, the measurement method, observation of the failure and remarks to testing in detail.
Abstract
Overview
IEC TR 62866:2014 is a Technical Report by the International Electrotechnical Commission (IEC) that focuses on in printed wiring boards (PWBs) and assemblies. Electrochemical migration, also known as ion migration, is a key reliability concern in modern electronic assemblies, particularly as electronic products become more compact and complex. This report details the mechanisms by which electrochemical migration leads to degradation and failure in PWBs, comprehensive test methods, ways to observe failures, and critical considerations for effective testing.
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