IEC TR 62878-2-7:2019 PDF

Name: IEC TR 62878-2-7:2019 — Device embedding assembly technology - Part 2-7: Guidelines - Accelerated stress testing of passive embedded circuit boards
SKU: IEC TR 62878-2-7:2019
Price: 35 EUR
Availability: InStock

Device embedding assembly technology - Part 2-7: Guidelines - Accelerated stress testing of passive embedded circuit boards

Название (английский):

IEC TR 62878-2-7:2019

Device embedding assembly technology - Part 2-7: Guidelines - Accelerated stress testing of passive embedded circuit boards

Статус документа:: Действующий
Формат:: Электронный (PDF)
Количество страниц:: 12
Дата публикации:: 20 марта 2019 г.
Издание:: IEC TR 62878 edition 1 version 1
ICS:: 31.180

Тип поставки:

Full version180 €Read online 24h10 €Read online 72h15 €

Язык документа:

ruen

Срок поставки:2 раб. дн. (перевод)

Цена:180 €

Описание (английский):

IEC TR 62878-2-7:2019 (E) describes the accelerated stress testing of passive embedded circuit boards. It can be used for screening finished boards, including multilayer and high-density interconnection (HDI) boards. These boards are mainly for mobile devices.

Abstract

Похожие стандарты

Упомянутые в описании и другие стандарты IEC

Overview

IEC TR 62878-2-7:2019 is a Technical Report that provides guidelines for accelerated stress testing of passive embedded circuit boards. It is focused on screening finished multilayer and high-density interconnection (HDI) embedded boards - particularly those used in mobile devices - to assess reliability under combined thermal, environmental and mechanical stresses.

Key topics and technical requirements

Combined-stress test method: simultaneous thermal heating, humidity control and mechanical bending/vibration to better simulate real-world conditions.

Thermal conditions: target circuit temperatures are controlled electrically; a typical test uses 325 °C for 1 hour for materials with high decomposition temperature (Td > 350 °C). An alternative setting of 305 °C for 1.5 hours is given for lower-Td materials.

Environmental conditions: chamber set to 85 °C / 85 % RH (Dewpoint control with DI water recommended).

Mechanical stress: dynamic bending (typical 2 mm deflection for standard MLCC; 1 mm for MLCC thinner than 150 µm) with vibration; test coupons are mounted in a validated bending tester placed inside the temperature-humidity chamber.

Test coupons and stack-up: sample coupon size 35 × 5 mm; design rules include 100 µm line width, 350 µm via pad, and layer stack-up totaling 540 ± 54 µm. Test coupons incorporate heating circuits tied to embedded passives.

Monitoring and failure criterion: real-time voltage monitoring across the heated circuit; failure defined as >20% increase in output voltage (indicative of resistance increase). Failed samples are cross-sectioned (via area) for root-cause analysis.

Reporting: record and store time-history voltage data and cross-section images. The TR also includes coupon design rules and bending tester setup (Annex A and B).

Practical applications and users

Who benefits:

PCB designers and layout engineers designing passive-embedded multilayer or HDI boards for mobile products.

Reliability and test engineers developing screening plans for embedded passive PCBs.

Manufacturing and quality teams in PCB fabrication and assembly houses performing lot screening.

Independent test laboratories conducting accelerated reliability qualification.

Practical uses:

Pre-production screening to detect via cracking, interconnect weakness, or early-life failures.

Comparative assessment of material/process changes (e.g., new prepregs, lamination).

Validating assembly processes and embedded passive integration for mobile device PCBs.

Related standards

Normative reference: IEC 60194 (printed board design/terms and definitions).

IEC TR 62878 is part of the broader Device embedding assembly technology series - refer to the IEC webstore for other parts and updates.

Keywords: IEC TR 62878-2-7:2019, accelerated stress testing, passive embedded circuit boards, HDI, multilayer PCB, bending tester, 85°C/85% RH, via cracking, mobile device PCB reliability.

IEC TR 62878-2-7:2019 PDF

Abstract

Похожие стандарты

Overview

Key topics and technical requirements

Practical applications and users

Related standards

Технические детали

IEC 60194:2015

Printed board design, manufacture and assembly - Terms and definitions

IEC 60050-161:1990/AMD2:1998

Amendment 2 - International Electrotechnical Vocabulary (IEV) - Part 161: Electromagnetic compatibility

IEC 60335-2-24:2020/COR1:2021

Corrigendum 1 - Household and similar electrical appliances - Safety - Part 2-24: Particular requirements for…

IEC 61753-084-2:2007/COR1:2008

Corrigendum 1 - Fibre optic interconnecting devices and passive components performance standard - Part 084-2:…

IEC 62716:2013/COR1:2014

Corrigendum 1 - Photovoltaic (PV) modules - Ammonia corrosion testing

IEC 62946-02:2017/COR1:2020

Corrigendum 1 - Connectors for electronic equipment - Part 02: Detail specification for 8-way, unshielded, fr…

IEC 61753-1:2018/COR1:2019

Corrigendum 1 - Fibre optic interconnecting devices and passive components - Performance standard - Part 1: G…

IEC 61207-3:2002/COR2:2003

Corrigendum 2 - Gas analyzers - Expression of performance - Part 3: Paramagnetic oxygen analyzers