Overview
IEC TR 62899-303-2:2024 is a Technical Report from the IEC TC 119 series that defines a framework for standard mechanical dimensions of equipment used in printed electronics. Focused on sheet‑to‑sheet (S2S) printing, the document covers substrate‑based printing systems and remains flexible enough to apply to transient or non‑traditional printing equipment. It provides manufacturers, integrators and users with a common vocabulary and dimensional baseline for S2S printing equipment - promoting interoperability, clearer procurement specifications and scalable production.
Key topics and technical requirements
This Technical Report lays out the mechanical parameters and measurement considerations that equipment suppliers and users should specify and verify:
- General measurement conditions: dimensions specified at controlled room temperature and humidity and reported with measurement conditions.
- S2S printing system types: feed‑only S2S and S2S with shuttles (device that carries substrates).
- Maximum and minimum substrate dimensions (length and width) for systems both with and without shuttle.
- Maximum printable width and length - the usable print area relative to substrate handling limits.
- Shuttle mechanics and dimensions: shuttle width, shuttle length, and shuttle thickness details and examples.
- Shuttle, gap and repeat lengths: definitions and dimensional guidelines for multi‑step and repeat printing operations.
- Alignment and trigger marks: terminology and usage for accurate sheet positioning and print initiation.
- Examples and informative annexes: illustrative dimensions for common substrates (e.g., Si wafer, ISO A‑series paper formats) and an example equipment specification template.
Keywords naturally present in the report include: IEC TR 62899-303-2:2024, printed electronics, sheet-to-sheet printing, mechanical dimensions, substrate, shuttle, alignment mark, trigger mark.
Practical applications and intended users
Who benefits from IEC TR 62899-303-2:2024:
- Equipment manufacturers and OEMs - to design machines with standardized substrate handling envelopes and shuttle interfaces.
- System integrators and production engineers - to verify compatibility of modules and automate feeding/alignment systems.
- Procurement and specification writers - to create unambiguous mechanical requirements for tenders and contracts.
- R&D teams and test laboratories - to compare equipment performance using consistent dimensional baselines.
- Printed electronics manufacturers (including flexible electronics and wafer‑based processes) - for scalable, repeatable production layouts.
Practical benefits: improved interoperability, reduced integration risk, consistent documentation for supplier evaluation, and clearer pathways to scale printed electronics manufacturing.
Related standards (if applicable)
- Other parts of the IEC 62899 series (Printed electronics) - see IEC webstore for the series list.
- IEC 62899-101:2019 (terminology and related S2S references).
- IEC Electropedia and ISO Online Browsing Platform for standardized terms and definitions.
For implementation, consult the full IEC TR 62899-303-2:2024 document to use its figures, examples and the sample equipment specification included in the report.