Overview - IEC TR 63357:2022 (Fault test method roadmap for automotive semiconductor devices)
IEC TR 63357:2022 is a Technical Report that provides a standardization roadmap of fault test methods for integrated circuits (ICs) used in automotive vehicles. It focuses on fault detection and testability for semiconductors exposed to harsh automotive environments - extreme temperatures, vibration, electromagnetic and high‑frequency signals (e.g., automotive RADAR and V2X). The report summarizes background, key technologies (JTAG, DFT, DFM, scan test, ATPG), terminology (fault, failure, transient vs. permanent, fault coverage) and identifies standardization priorities and actions.
Key topics and technical requirements
- Scope and motivation: Addresses why automotive semiconductors need dedicated fault test methods because of environmental stresses and increasing RF/vehicle‑to‑everything (V2X) use.
- Terminology and metrics: Defines critical terms used in testability and dependability such as fault, failure, error, fault coverage, test coverage, and fault models.
- Fault test technologies:
- JTAG / IEEE 1149.x (boundary scan) for interconnect and board-level testing.
- Design for Testability (DFT) and Design for Manufacturability (DFM) techniques that embed test features into ICs.
- Scan test, scan chains/cells, and automatic test pattern generation (ATPG) to create and apply test vectors and measure fault coverage.
- Fault simulation methods for evaluating test set quality.
- Environmental & RF considerations: Discusses interaction with automotive RADAR bands (e.g., 24 GHz and 77–81 GHz ranges) and wireless/V2X frequency allocations, highlighting the need to consider RF immunity and high‑frequency test conditions.
- Roadmap deliverables: A table of standardization actions (technology areas, gaps, and priorities) to guide future standards work for automotive fault testing.
Applications - who uses this standard
- Semiconductor designers and test engineers building automotive ICs and SoCs
- Automotive OEMs and Tier‑1 suppliers validating component robustness
- Test equipment vendors implementing ATPG, scan, and JTAG capabilities
- Certification bodies and standards committees aligning test methods for automotive safety and reliability
- System integrators and maintenance teams assessing field failures and diagnostics
Related standards and references
- IEC 60050‑192 (dependability vocabulary)
- IEEE 1149.1 (JTAG / boundary‑scan)
- Regional V2X and RADAR regulatory standards (ETSI, IEEE, ARIB et al.) referenced in the report
IEC TR 63357:2022 is a practical roadmap for harmonizing fault test methods in automotive semiconductors - improving robustness, fault coverage, and interoperability across design, manufacturing, and in‑vehicle testing workflows. Keywords: IEC TR 63357:2022, fault test method, automotive semiconductor, JTAG, DFT, scan test, ATPG, V2X, automotive RADAR.