Overview
IEC TS 61994-4-4:2018 is a technical specification published by the International Electrotechnical Commission (IEC) that defines a comprehensive glossary for single crystal wafers used in surface acoustic wave (SAW) devices. Part of the broader IEC 61994 series, this document targets piezoelectric, dielectric, and electrostatic materials and devices crucial for frequency control, selection, and detection applications. This edition incorporates updated terminology in alignment with IEC 62276:2016 and reflects changes in related technical committee titles, signifying its adherence to the current state of the art.
The use of standardized definitions supports clear communication and precise specification throughout the electronics industry, especially vital in sectors focusing on advanced frequency control and filtering components.
Key Topics
IEC TS 61994-4-4:2018 covers terminology and definitions relevant to:
- Single Crystal Wafer Materials for SAW Devices
- As-grown synthetic quartz crystal
- Lithium niobate (LN)
- Lithium tantalate (LT)
- Lanthanum gallium silicate (LGS)
- Lithium tetraborate (LBO)
- SAW Device Wafer Properties
- Flatness metrics, including site-specific and total thickness variation
- Crystal orientation and methods of specification
- Appearance defects (chips, scratches, pits, orange peel)
- Process-Specific Terms
- Curie temperature
- Polarization and reduction processes
- Single domain characteristics
- Manufacturing and Quality Aspects
- Bevel, orientation flat (OF), secondary flat (SF)
- Manufacturing lots and tolerance definitions
The document integrates updated terminology to facilitate a consistent language for materials selection, processing, metrology, and device manufacturing.
Applications
The standardized glossary provided in IEC TS 61994-4-4:2018 is applicable across multiple stages and sectors involved in SAW device development and use:
- Component Manufacturing:
Clear terms for piezoelectric single crystal wafers help manufacturers specify, verify, and communicate material requirements and quality metrics with suppliers and clients.
- Research and Development:
Researchers benefit from uniform definitions when pioneering new SAW materials, optimizing wafer properties, or designing innovative frequency control devices.
- Quality Assurance and Metrology:
Consistent descriptors of defects, surface conditions, and geometric tolerances underpin standardized inspection and measurement methods, ensuring product conformance.
- Procurement and Supply Chain:
Accurate terminology reduces the risk of misinterpretation in technical specifications, tender documents, and supply agreements.
These applications are particularly relevant to sectors such as telecommunications, signal processing, sensors, and precision timing, where SAW technology plays a critical role.
Related Standards
For comprehensive implementation, IEC TS 61994-4-4:2018 should be considered in conjunction with related standards, including:
- IEC 62276:2016
Single Crystal Wafers for Surface Acoustic Wave (SAW) Device Applications – Specifications and Measuring Methods
Provides detailed specifications and measurement methodologies for the properties and performance of SAW device wafers.
- Other parts of IEC 61994 series
Offer additional terminology and guidelines for piezoelectric, dielectric, and electrostatic materials and components.
- IEC Electropedia
An online resource for cross-referencing electrotechnical vocabulary as used in international standards.
By leveraging IEC TS 61994-4-4:2018, stakeholders benefit from a harmonized vocabulary that streamlines cross-industry collaboration, improves product quality, and supports ongoing technical innovation in the field of SAW device materials.