Overview
IEC TS 62647-22:2013 - Process management for avionics: Technical guidelines - provides practical guidance for aerospace, defence and high‑performance (ADHP) electronic systems transitioning to lead‑free (Pb‑free) solder. It supplements IEC/TS 62647‑1:2012 by describing design, manufacturing, testing and maintenance practices to preserve reliability, airworthiness, safety and maintainability of avionics equipment during and after Pb‑free conversion. The document also captures lessons learned from prior Pb‑free aerospace implementations.
Key topics and technical scope
This technical specification addresses the full system lifecycle with emphasis on process management and risk reduction for Pb‑free avionics electronics. Major topics include:
- General Pb‑free solder alloy behavior (temperature effects, thermal cycling, stress relaxation)
- System level service environments (steady and cyclic temperatures, vibration, shock, humidity, salt spray and cooling‑air quality)
- High‑performance electronics testing (thermal cycling, vibration, shock, combined environments)
- Solder joint reliability and mixed metallurgy (Pb‑free/tin‑lead interactions, bismuth effects, modeling)
- Piece parts and PCB/PWB considerations (terminal finishes, plated through‑holes, copper dissolution, laminate CTE, surface finishes)
- Assembly and manufacturing practices (process coupons, fluxes, cleaning, inspection)
- Module assembly and conformal coatings
- Rework, repair and depot maintenance (area‑array rework, mixed‑alloy profiles, cleaning)
- Generic life testing, similarity analysis and qualification
The standard includes informative annexes, risk tables (e.g., finish compatibility, whisker risk), and process recommendations without prescribing a single mandatory method.
Practical applications
IEC TS 62647‑22 is used to:
- Develop Pb‑free design rules and process controls for avionics PCBs and modules
- Define qualification and acceptance testing for Pb‑free assemblies (thermal, vibration, shock)
- Guide maintenance, depot repair and configuration control during Pb‑free transitions
- Assess mixed‑metallurgy risks (BGA, SMT, through‑hole) and select compatible finishes and fluxes
- Inform conformity and airworthiness evidence for OEMs and MROs
Who should use this standard
- OEM design and manufacturing engineers in aerospace and defence
- System integrators, maintenance, repair and overhaul (MRO) facilities
- Reliability, qualification and quality assurance teams working with Pb‑free electronics
- Procurement and certification personnel evaluating parts and processes for avionics
Related standards
- IEC/TS 62647‑1:2012 (process management framework for Pb‑free avionics)
- Applicable IPC, JEDEC and aerospace wiring/airworthiness standards for complementary guidance
IEC TS 62647‑22 is a practical, application‑focused resource to manage the technical and reliability risks of switching to Pb‑free solder in high‑performance aerospace and defence electronic systems.