Overview
IEC TS 62647-4:2018 - Process management for avionics: Part 4 - Ball grid array (BGA) re-balling defines administrative and technical requirements for replacing solder balls on Ball Grid Array (BGA) component packages within an Electronic Components Management Plan (ECMP) for aerospace, defence and other high‑reliability systems. The Technical Specification provides guidance for re-balling providers to establish, implement and maintain a re-balling process that supports lead‑free solder requirements and the stringent traceability, quality and configuration controls expected in avionics and defence electronics.
Key topics and technical requirements
This TS focuses on process control and traceability across the BGA re-balling lifecycle. Major topics include:
- Process approach and typical workflow for de‑balling and re‑balling operations, including flowcharts and process-awareness requirements.
- Customer and re‑balling provider responsibilities, including roles within an ECMP and order of precedence for contractual requirements.
- Inspection and incoming control for received BGA components and separate solder balls (acceptance, visual inspection, and documentation).
- De‑balling and re‑balling procedures: temperature control, preheat, flux and solder paste selection, ball placement (alignment and co‑planarity), reflow profiles, cooling, and post‑process cleaning.
- Environmental and handling controls: electrostatic discharge (ESD) protection, moisture/reflow sensitivity management, facility and personnel proficiency requirements.
- Quality, records and configuration management: lot records, process monitoring, failure handling, segregation and packaging/shipping of re‑balled BGAs.
- Qualification and testing: new part‑number qualification, similarity assessments, production lot tests and test methods (see Annex C), with templates for tailoring test plans (Annexes A, B, D).
- Counterfeit prevention and traceability obligations and procedures.
Practical applications
IEC TS 62647-4 is used to:
- Establish or audit a BGA re‑balling process for lead‑free solder environments in avionics/defence programs.
- Support obsolescence mitigation and component repair strategies for high‑reliability PCBs where replacement parts are unavailable.
- Ensure compliance with ECMPs and customer quality requirements for military, aerospace and other safety‑critical electronics.
- Define acceptance criteria, test plans and documentation standards for suppliers performing re‑balling as a subcontracted service.
Who should use this standard
- BGA re‑balling providers, repair centres and subcontractors
- Aerospace and defence OEMs, supply chain quality and procurement teams
- Engineering, reliability and obsolescence managers for high‑reliability electronics
- Quality auditors and certification assessors working to ECMP requirements
Related standards
- Other parts of the IEC 62647 series covering process management for avionics and lead‑free soldered systems.
- Referenced normative documents and test methods listed inside the TS for complete implementation and compliance.