IEC TS 62878-2-10:2024 PDF
Device embedding assembly technology - Part 2-10: Design specification for cavity substrate
Device embedding assembly technology - Part 2-10: Design specification for cavity substrate
- Статус документа:
- Действующий
- Формат:
- Электронный (PDF)
- Количество страниц:
- 9
- Дата публикации:
- 31 января 2024 г.
- Издание:
- IEC TS 62878 edition 1 version 1
- ICS:
- 31.180
IEC TS 62878-2-10:2024 provides a general specification for the design of cavity substrates.
Abstract
Overview
IEC TS 62878-2-10:2024 addresses the design specification for cavity substrates within the context of device embedding assembly technology. Issued by the International Electrotechnical Commission (IEC), this technical specification establishes general guidelines for the design and fabrication of cavity substrates used in advanced electronic packaging.
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