Overview
IEC TS 62878-2-4:2015 is a technical specification developed by the International Electrotechnical Commission (IEC) focused on device embedded substrates, specifically providing guidelines for Test Element Groups (TEG). Device embedded substrates are advanced interconnection solutions where active and passive components are directly embedded into the substrate structure. This part of the IEC 62878 series details the methodologies and recommendations for designing and using TEG devices to measure basic properties and evaluate the quality and reliability of such substrates-primarily those fabricated using organic base materials.
The standard targets device embedded substrates used in the fabrication of electronic wiring boards, including various discrete components and sheet-formed elements. It is not applicable to re-distribution layers (RDL) or electronic modules defined in other specific IEC standards.
Key Topics
- Test Element Groups (TEG): The core focus is on the structures, preparation, and application of TEGs used in evaluating embedded substrates. TEGs serve as dummy test chips containing standard patterns designed to assess electrical, mechanical, and reliability properties.
- Test Conditions and Environments: The standard outlines the recommended test conditions, including temperature, humidity, and atmospheric pressure, ensuring consistency across measurement procedures for embedded device substrates.
- Sample Preparation: Guidance on selecting, preparing, and handling test specimens is included, covering both actual embedded boards and TEG-based test patterns.
- Evaluation Items: The document provides a comprehensive list of properties to evaluate, such as conductor resistance, insulation resistance, adhesion strength, and environmental stress resistance (including thermal cycling, vibration, and humidity).
- Arrangements and Patterns: Recommendations are given for the layout of TEGs, including area array and peripheral arrangements, pad pitches, and structure types suitable for testing both active and passive device embeddings.
Applications
IEC TS 62878-2-4:2015 is widely applicable in sectors utilizing advanced electronic packaging and interconnect technologies. Its key uses include:
- Quality Assurance in Manufacturing: Ensures repeatable and comparable test methods for device embedded substrates in consumer, industrial, and automotive electronics.
- Research and Development: Supports standardized evaluation for new substrate designs involving embedded components, aiding innovation and process improvement.
- Supplier-Client Agreements: Facilitates clear communication and specification of test methods and acceptance criteria between manufacturers and clients when embedding devices.
- Reliability Testing: Enables comprehensive assessment of embedded device reliability under diverse environmental conditions, which is vital for critical applications such as automotive control systems or industrial automation.
This standard aids organizations in achieving robust, reliable embedded substrate products by providing detailed and uniform guidelines for testing and evaluation.
Related Standards
IEC TS 62878-2-4:2015 is part of a broader series on device embedded substrates. Related references include:
- IEC 62878-1-1: Device embedded substrate - Part 1-1: Generic specification – Test methods
- IEC TS 62878-2-1: Device embedded substrate - Part 2-1: General description of the technology
- IEC TS 62878-2-3: Device embedded substrate - Part 2-3: Guidance on design
- IEC 60194: Printed board design, manufacture and assembly - Terms and definitions
Organizations benefit from consulting these standards collectively to establish a comprehensive approach to the design, manufacture, and testing of device embedded substrates.
Keywords: device embedded substrate, IEC TS 62878-2-4, Test Element Groups, TEG, embedded devices, organic base material, electronic wiring board, electrical testing, reliability, quality assurance, electronic substrate standards