ISO 4746:1977 PDF

Name: ISO 4746:1977 — Oxygen-free copper — Scale adhesion test
SKU: ISO 4746:1977
Price: 25 EUR
Availability: InStock

Oxygen-free copper — Scale adhesion test

Название (английский):

ISO 4746:1977

Oxygen-free copper — Scale adhesion test

Статус документа:: Действующий
Формат:: Электронный (PDF)
Количество страниц:: 1
Дата публикации:: 1 августа 1977 г.
Издание:: ISO IS 4746 edition 1 version 1
ICS:: 77.040.99

Тип поставки:

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Язык документа:

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Срок поставки:1 раб. дн. (перевод)

Цена:15 €

Описание (английский):

Provides a means of assessing the usability in electronic devices, for applications involving glass-to-metal seals, or other uses relying on the formation and presence of an adherent film of copper oxide. The procedure includes preparation and heating in air of a test piece, followed by rapid cooling in water and visual examination for loss of the oxide film or blistering.

Abstract

Overview

Key Topics

Preparation of Test Pieces: Ensures all surface oxidation, inclusions, and discontinuities are removed from the copper sample. The required surface finish is similar to that achieved by wet grinding with 400-grade silicon carbide, followed by careful cleaning and degreasing.
Heating Procedure: Test pieces are heated in air at 850°C to 875°C for 30 minutes and then rapidly cooled in cold water. This process forms the oxide scale whose adhesion is subsequently evaluated.
Visual Assessment: After cooling, the test piece is visually examined. The evaluation focuses on the integrity and adherence of the black oxide film, checking for any blistering or flaking that would indicate a failed test.
Acceptance Criteria: The oxide film must remain substantially unbroken and firmly attached; slight edge loss is permissible, but the overall film should be even in coloration and free from significant defects.

Applications

Electronic Devices: Oxygen-free copper is widely used in electronic applications where high electrical conductivity and reliable surface properties are required. The scale adhesion test ensures the copper will maintain a consistent performance over time, especially where oxide film stability is crucial.
Glass-to-Metal Seals: Many high-reliability electrical and electronic components rely on robust glass-to-metal bonding. The quality of the copper oxide layer directly impacts the performance and longevity of these seals, making rigorous adhesion testing essential.
Specialty and High-Vacuum Applications: In applications sensitive to contamination or requiring strong, adherent oxide films, such as vacuum equipment or scientific instrumentation, adherence of the oxide layer improves reliability and prevents issues from flaking or film loss.
Quality Assurance: Manufacturers and suppliers of oxygen-free copper use this standard as part of their quality control systems, verifying that their material will meet the stringent requirements of advanced industrial applications.

Related Standards

ISO 1811: Methods for testing the mechanical properties of copper.
ISO 6509: Corrosion of metals and alloys - Determination of dealloying resistance of copper alloys.
ISO 2626: Copper and copper alloys - Sampling for chemical analysis.
IEC Materials Standards: Electrical properties testing for copper conductors.

Practical Value

By adhering to ISO 4746:1977, manufacturers, quality assurance teams, and end-users can ensure the consistent performance of oxygen-free copper in advanced technologies. The standardized adhesion test method minimizes the risk of oxide film defects that could compromise product function, reliability, or lifespan, particularly in demanding environments. This standard is a critical reference for any operation specifying, converting, or certifying oxygen-free copper for specialized uses.

Keywords: ISO 4746, oxygen-free copper, scale adhesion test, copper oxide film, electronic devices, glass-to-metal seals, copper quality control, international standards, copper testing.

Технические детали

Технический комитет: ISO/TC 26 - Copper and copper alloys
SKU: ISO 4746:1977

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